Power Semiconductor Module Layout for Noise-Isolated Sensor Lines
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Solution Overview
Problem
As output voltage increases in power conversion devices, radiation noise from wires connected to power semiconductor elements interferes with detection signals of sensor elements like shunt resistors, reducing their accuracy.
Innovation Solution
A power semiconductor module with a heat dissipation plate featuring a shield layer and through-holes, where only sensor line portions are drawn out to the rear surface, shielding radiation noise and separating power and sensor lines to prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the output voltage is increased to meet power conversion device requirements, then the power transmission capability is improved, but the radiation noise from wires increases which interferes with sensor detection signals
Solution Approach 1:
The patent divides the module into distinct regions: a front surface region for power lines and a rear surface region for sensor lines, separated by a partition wall. This spatial segmentation prevents radiation noise from power lines from interfering with sensor detection signals, allowing high output voltage operation while maintaining detection accuracy.
Solution Approach 2:
The patent extracts sensor lines from the front surface region where radiation noise is generated, and routes them through the rear surface region. By taking sensor lines out of the noisy environment, the detection signals remain accurate even when high power is transmitted through the power semiconductor element.
2Measurement precision
If sensor elements are provided inside the power semiconductor module for current detection, then the detection capability is improved, but the detection accuracy decreases due to interference from radiation noise
Solution Approach 1:
The module is segmented into a front surface region containing power lines and a rear surface region containing sensor lines, divided by a partition wall. This segmentation isolates the sensor elements from radiation noise generated by power lines, enabling accurate current detection even when the sensor is integrated inside the power semiconductor module.
Solution Approach 2:
The patent utilizes the third dimension (depth/vertical direction) by routing sensor lines through the rear surface of the substrate, creating a vertical separation between power lines on the front surface and sensor lines on the rear surface. This dimensional approach effectively shields sensor signals from radiation noise without increasing horizontal distance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses radiation noise from affecting detection signals, enhancing the accuracy of sensor elements like shunt resistors in power conversion devices.
Implementation Method 1
the heat dissipation plate includes a shield layer made of a material having at least one of electrical conductivity and magnetism
Implementation Method 2
a heat dissipation plate that has a front surface on which the power semiconductor element is mounted, and a rear surface opposite to the front surface, and is configured to dissipate heat from the power semiconductor element
Data Source
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AI summary
A power semiconductor module includes a power semiconductor element, a first power line portion and a second power line portion respectively electrically connected to a first electrode and a second electrode of the power semiconductor element, a heat dissipation plate capable of dissipating heat from the power semiconductor element, a sensor element mounted on a front surface of the heat dissipation plate, and a first sensor line portion and a second sensor line portion electrically connected to the sensor element. The heat dissipation plate has at least one through-hole passing through between the front surface and a rear surface. The first sensor line portion and the second sensor line portion are drawn out to a region on the rear surface of the heat dissipation plate through the through-hole.