Power Module Frame With Embedded Current Sensor Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power modules face challenges in integrating current sensors efficiently, leading to increased waste and costs due to non-functional sensors being incorporated post-assembly.
Innovation Solution
A method involving injection-molding a frame around current sensor components, including a current terminal and magnetic cores, to embed the sensor within the power module, allowing for pre-assembly testing and secure integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If current sensors are incorporated post-assembly, then assembly flexibility is maintained, but waste and costs increase due to non-functional sensors being integrated
Solution Approach 1:
The patent applies preliminary action by performing sensor functionality testing before final assembly integration. The method involves injecting molding material around sensor components and test circuitry, then testing the sensor functionality while the module is still in a semi-assembled state. This allows non-functional sensors to be identified and replaced before final assembly, preventing waste of functional components and reducing costs.
2Ease of manufacture
If current sensors are tested after final assembly, then assembly process is simplified, but functional defects are discovered too late causing rework and waste
Solution Approach 1:
The patent implements preliminary testing by incorporating test circuitry during the injection molding process, before final assembly is completed. The test current is conducted through the sensor components while the module is in a semi-assembled state, allowing functional defects to be identified early. This preliminary action prevents the need for time-consuming disassembly and rework that would be required if testing were performed after final assembly.
3Productivity
If injection molding is used to embed components, then integration efficiency is improved, but mold complexity and manufacturing difficulty increase
Solution Approach 1:
The patent applies segmentation by dividing the injection molding process into distinct phases: first injecting a support structure material around the sensor components and test circuitry, then separately injecting the final module housing material. This segmented approach allows each molding phase to be optimized independently, reducing overall mold complexity while maintaining high integration efficiency. The support structure acts as a temporary scaffold that simplifies the first molding operation.
Solution Approach 2:
The patent uses an intermediary support structure that is injected first and serves as a mediator between the sensor components and the final housing. This support structure facilitates the injection molding process by providing a stable framework during the first molding phase, reducing the complexity of directly molding the final housing around loose components. The support structure is later removed, leaving the sensor components properly embedded in the final module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient integration of current sensors within power modules, reducing waste and costs by ensuring functional sensors are integrated before final assembly, enhancing power density and connectivity.
Implementation Method 1
forming the frame using the molding tool by injection-molding around the components arranged in the molding tool so that the components are embedded in the frame
Data Source
AI summary
The disclosure relates to a method of forming a power module, wherein a current sensor is at least partially integrated in a mold of a frame of the power module. The disclosure relates further to a corresponding power module.