Power Module Shielding Substrate for Signal Pin EMI Control
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Solution Overview
Problem
Existing power modules are susceptible to electromagnetic interference (EMI) from environmental electromagnetic waves, which can degrade device performance and cause damage, necessitating a solution to shield and reduce the impact of electromagnetic waves on both the system control circuit and the surrounding environment.
Innovation Solution
A power module design incorporating a power circuit board, signal pins, a shielding substrate, and electrically insulating components, where the shielding substrate is spaced apart from the power circuit board and connected via ground pins, with electrically insulating components ensuring signal pins are insulated from the shielding substrate, and a cover body enclosing both to provide electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding substrate is added to block electromagnetic waves, then electromagnetic interference protection is improved, but device complexity increases
Solution Approach 1:
The patent implements nesting by placing the shielding substrate inside the cover body, creating a nested structure where the shielding substrate is contained within the housing. This approach provides EMI protection while maintaining a compact overall form factor, as the shielding function is integrated within the existing structural envelope rather than adding external bulk.
Solution Approach 2:
The shielding substrate is implemented as a thin planar structure with through-holes, functioning as a flexible shielding barrier. This thin-film approach provides effective electromagnetic wave blocking while minimizing the thickness and visual impact of the shielding component, reducing the perceived complexity addition.
2Ease of operation
If signal pins are directly exposed, then ease of connection is improved, but electromagnetic interference susceptibility increases
Solution Approach 1:
The patent applies local quality by providing electrically insulating components specifically at the signal pin locations where they are needed, rather than uniformly insulating the entire structure. The insulating components are placed locally around signal pins to provide EMI protection precisely where electrical connections are made, maintaining connection convenience while protecting vulnerable points.
Solution Approach 2:
Electrically insulating components are introduced as intermediary elements between the signal pins and the shielding substrate. These mediators allow the signal pins to maintain their connection function while being electrically isolated from the shielding substrate, preventing direct electrical contact that would compromise signal integrity while still providing EMI shielding.
3Reliability
If electrically insulating components are added to isolate signal pins, then electrical insulation is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the electrically insulating components: they provide electrical insulation for signal pins, structural support for positioning, and integration with the shielding substrate through the through-holes. By combining these functions into single components rather than using separate elements for each function, the overall component count and structural complexity are reduced.
Solution Approach 2:
The electrically insulating components are designed to serve multiple purposes: insulating signal pins from the shielding substrate, providing mechanical positioning, and facilitating assembly. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity while achieving reliable electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields electromagnetic interference, preventing leakage of electromagnetic waves from the power chips and ensuring electrical insulation between signal pins and the shielding substrate, thereby protecting the system control circuit and reducing interference with the environment.
Implementation Method 1
the shielding substrate is located above the power circuit board and spaced apart from the power circuit board... effectively shields electromagnetic interference, preventing leakage of electromagnetic waves from the power chips
Implementation Method 2
The electrically insulating component surrounds the signal pin... ensuring electrical insulation between signal pins and the shielding substrate
Data Source
AI summary
A power module includes a power circuit board, a signal pin, a shielding substrate, and an electrically insulating component. The signal pin is disposed and stands on the power circuit board. The shielding substrate is located above the power circuit board and spaced apart from the power circuit board. The shielding substrate has a first through hole. The signal pin is disposed through the first through hole. The electrically insulating component surrounds the signal pin. The electrically insulating component has a second through hole. The signal pin is disposed through the second through hole. The signal pin is spaced apart from the shielding substrate by a distance by the electrically insulating component.