3D Power Module Shim Layout for Multi-Chip Compatibility
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Solution Overview
Problem
Existing semiconductor power modules are designed specifically for particular chip sizes and contact arrangements, making it impossible to use different chips without extensive redesign of the manufacturing method, leading to significant delays and costs when switching chip suppliers.
Innovation Solution
A power module design that incorporates a shim with openings and tracks to accommodate different chip sizes and contact arrangements, allowing for compatibility with various chip models without modifying the module's housing elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the module is designed specifically for a particular chip size and contact arrangement, then the manufacturing process is optimized for that specific chip, but the module cannot accommodate different chip models without extensive redesign
Solution Approach 1:
The module is divided into distinct functional components: a standardized housing element with cutouts, interchangeable shims for different chip types, connection elements, and capacitors. This segmentation allows the housing and most components to remain unchanged while only the shim needs to be replaced when switching chip models, resolving the contradiction between manufacturing optimization and adaptability
Solution Approach 2:
The housing element with its specific cutout configuration serves as a universal platform that can accommodate multiple chip models. By designing the housing with standardized features and interchangeable shims, the same housing structure can support different chip sizes and contact arrangements, enabling one housing design to serve multiple functions across different chip variants
2Adaptability or versatility
If the module design is changed to accommodate different chip models, then chip compatibility is improved, but manufacturing delays and costs increase significantly
Solution Approach 1:
Shims are pre-designed and pre-manufactured for different chip models, with each shim configured for specific chip dimensions and contact arrangements. When a chip model change is needed, the appropriate pre-prepared shim is simply selected and installed, eliminating the need for time-consuming redesign and retooling of the manufacturing process
Solution Approach 2:
The shim acts as an intermediary component between the standardized housing element and the various chip models. It mediates the interface between the fixed housing geometry and the variable chip characteristics, allowing different chips to be accommodated without modifying the housing or other major components, thus avoiding manufacturing delays
3Adaptability or versatility
If extensive redesign of the manufacturing method is performed to use different chips, then chip compatibility is achieved, but additional costs increase significantly
Solution Approach 1:
By segmenting the module into standardized housing elements and interchangeable shims, the invention isolates the only component that needs to change (the shim) when switching chip suppliers. This minimizes the scope of redesign and retooling costs, as the expensive housing molds and assembly processes can be reused across different chip models
Solution Approach 2:
The standardized housing element with its specific cutout configuration creates a universal platform that can accommodate multiple chip types. This universality allows manufacturers to maintain the same housing design and manufacturing process while simply changing the shim and chip, significantly reducing the costs associated with adapting to different chip suppliers
Data Source
AI summary
A power module incudes a first housing element (10) having a first cutout (12) for receiving a first chip (70; 70′; 70″), a first chip (70; 70′; 70″) at least partially received in the first cutout, having electrical contacts (71, 72, 73; 71′, 72′, 73′; 71″, 72″, 73″), and connection elements (41, 43, 45) electrically connected to the electrical contacts of the first chip. At least one insulating shim (90; 90′; 90″) is at least partially disposed in the first cutout so as to at least partially cover said chip, having at least one opening (91, 92; 91′, 92′; 91″, 92″) providing access to at least one electrical contact of the chip through the shim and/or at least one track (97″) ensuring the connection to one of the connection elements and/or a capacitor.