Power Module Packaging with Integrated Sensor and Signal Chip
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Solution Overview
Problem
Current power module packaging structures cannot precisely detect the working state of individual power chips, leading to potential damage and reduced service life due to high current or temperature issues.
Innovation Solution
A packaging structure that integrates sensors directly with each power chip and a signal chip on a circuit board, allowing for real-time detection and communication of working state data, reducing the need for direct connections and minimizing parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a sensor is installed on the DBC board and connected to pins by wire bonding to detect working state data, then the structure is simple and easy to operate, but only the working state data of the entire power module can be detected and working state data of each power chip cannot be precisely detected
Solution Approach 1:
The patent divides the detection system into separate sensors for each power chip. Instead of using a single sensor on the DBC board to detect overall module status, individual sensors are integrated with or positioned near each power chip to independently detect working state data (temperature, current) for each chip, enabling precise individual monitoring.
Solution Approach 2:
The patent introduces a signal chip as an intermediary component. The signal chip receives detection signals from multiple sensors, processes the data, and outputs the working state information of each power chip separately. This mediator enables individual chip detection without requiring complex direct wiring from each sensor to external monitoring systems.
2Loss of information
If each sensor is directly connected to the predetermined device, then working state data can be transmitted, but the quantity of pins increases and the structure becomes complex
Solution Approach 1:
The patent merges multiple sensor connection functions into a single signal chip. Instead of having separate direct connections from each sensor to the predetermined device (which would require multiple pins and complex wiring), all sensors are connected to the signal chip, which consolidates the data and provides a unified output interface.
Solution Approach 2:
The signal chip serves multiple functions: it receives detection signals from multiple different sensors, processes data from multiple power chips, and outputs working state information for each chip individually. This multi-functional component reduces overall system complexity while maintaining comprehensive monitoring capabilities.
Data Source
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AI summary
The disclosure relates to a packaging structure for a power module, a packaging method and an electric vehicle. The packaging structure includes: a circuit board (10); at least one power chip (20), where each power chip is fastened on the circuit board, and each power chip is integrated with a sensor (21) that is capable of detecting a working state of the power chip; and a signal chip (30), where the signal chip is fastened on the circuit board and separated from the power chip, a compiling program is preset in the signal chip, the signal chip is in a communication connection with each sensor, and the signal chip is configured to be capable of being in a communication connection with a predetermined device, so as to output working state data of each power chip to the predetermined device. By detecting the working state of each power chip, the power chip can be protected precisely in real time. The signal chip serves as a connection medium between the sensor and the predetermined device, to reduce a quantity of pins, thereby avoiding generation of an excessively high parasitic inductance.