Power Module Cover Contact With Sintered High-Temperature Joints
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Power modules with soldered connections experience detachment and reduced performance due to high temperatures and thermomechanical loads, leading to decreased power density and operational safety.
Innovation Solution
Implementing a sintered connecting layer using metal particles like silver or copper, which forms a high-temperature-resistant connection with an electrical cover contact element, providing both electrical and thermal conductivity, to stabilize power semiconductors and enhance module performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If soldered connections are used to connect power semiconductors and cover contact elements, then the assembly process is simple and cost-effective, but the connections melt and loosen under high temperatures above 230°C, reducing power density and operational safety
Solution Approach 1:
The patent changes the fundamental parameter of connection material from solder (melting point 210-300°C) to sintered metal particles (melting point >962°C for silver, >1085°C for copper). This parameter change in melting temperature enables the connection to withstand high operating temperatures above 230°C without melting or loosening, directly resolving the reliability issue while maintaining assembly effectiveness through sintering processes
Solution Approach 2:
The patent employs composite material structures: sintered connecting layers composed of metal particles (silver or copper) combined with binding agents, forming a composite material that achieves both high-temperature resistance and mechanical stability. The sintered metal particle structure provides thermal stability while the composite nature enables effective bonding to power semiconductors and cover contact elements
2Ease of manufacture
If soldered connections are used, then manufacturing costs are lower, but the power density and service life of the module decrease due to connection detachment under thermomechanical loads
Solution Approach 1:
The patent utilizes spherical or irregularly shaped metal particles for the sintered connecting layers. These curved particle structures pack efficiently and create multiple contact points during sintering, enhancing mechanical interlocking and connection strength. The particle morphology contributes to resistance against thermomechanical loads, extending service life under high-temperature operation
Solution Approach 2:
By changing the connection material from soft solder to sintered metal particles with higher melting points and superior mechanical properties, the patent achieves connections that maintain integrity under thermomechanical stress. This parameter change in material properties directly extends the duration of action and service life of the power module in high-temperature applications
3Ease of manufacture
If soldered connections are used, then the assembly process is straightforward, but operational safety is compromised due to melting and loosening of joints under high temperatures
Solution Approach 1:
The patent fundamentally changes the thermal parameter of the connection material by using sintered metal particles with melting points exceeding 962°C (silver) or 1085°C (copper), compared to solder with melting points of 210-300°C. This parameter change enables the connection to resist high-temperature damage and prevent joint melting or loosening during power module operation
Solution Approach 2:
The patent replaces the temperature-sensitive solder material with durable sintered metal particle connections that can withstand extreme thermal conditions. This substitution eliminates the vulnerability to high-temperature damage while maintaining effective electrical and thermal connectivity throughout the module's operational life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sintered connections offer improved detachment resistance, thermal conductivity, and increased power density and service life, even under extreme conditions, minimizing the need for additional temperature management measures.
Implementation Method 1
A sintered connection can be understood in particular as a connection which can be formed or is formed by sintering metal particles, for example silver and/or copper particles, for example at an elevated temperature, in particular below the melting temperature, and for example under increased pressure
Implementation Method 2
sintered connections can advantageously have a comparatively high thermal conductivity, for example on the order of >100 W/mK at room temperature
Data Source
AI summary
A power module. The power module includes a circuit carrier. A first sintered connecting layer is applied to the circuit carrier. At least one power semiconductor is applied to at least one portion of the first sintered connecting layer. At least one portion of a second sintered connecting layer is applied to the at least one power semiconductor. A portion of an electrical cover contact element is applied to the at least one portion of the second sintered connecting layer.