Electronic Power Module Using Sintered Paste for Thermal Dissipation
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Solution Overview
Problem
Current electronic power module packaging methods face challenges with excessive thickness and parasitic effects due to solder balls, as well as inefficient manufacturing processes, which hinder thermal dissipation and integration density.
Innovation Solution
The proposed solution involves a packaging structure using sintered thermoconductive paste for mechanical, electrical, and thermal coupling between substrates and dies, replacing solder balls with silver-based coupling regions, and employing DBC technology with ceramic insulators and copper layers for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used for coupling substrates and dice, then electrical connections are established, but the module thickness increases excessively and parasitic effects are introduced
Solution Approach 1:
The patent removes solder balls from the coupling structure entirely, replacing them with a flat copper-to-copper bonding interface. This extraction eliminates the spherical protrusions that increase thickness and create parasitic inductance, while maintaining electrical connectivity through direct metal-to-metal contact in the wire bond region.
Solution Approach 2:
The patent merges the electrical connection function and thermal conduction function into a single integrated copper bonding region. The copper layer serves dual purposes: establishing electrical pathways for signal transmission and providing a low-thermal-resistance path for heat dissipation, eliminating the need for separate coupling mechanisms.
2Reliability
If solder balls are used for coupling substrates and dice, then electrical connections are established, but parasitic effects are generated due to melting regions
Solution Approach 1:
The patent extracts the solder material from the coupling structure, replacing it with direct copper-to-copper bonding. This eliminates the melting regions and associated parasitic inductance and resistance that characterize solder ball connections, providing a cleaner electrical pathway with reduced harmful effects.
Solution Approach 2:
The patent changes the material parameter from solder alloy to pure copper, fundamentally altering the electrical and thermal characteristics of the coupling region. This parameter change reduces electrical resistance and thermal resistance while eliminating the phase change behavior that creates parasitic effects during operation.
3Reliability
If conventional packaging methods are used, then substrates are protected, but manufacturing time increases due to long process steps
Solution Approach 1:
The patent combines multiple manufacturing steps into fewer integrated operations. The copper layer is formed to serve multiple functions simultaneously: structural support, electrical connection, and thermal management. This consolidation reduces the total number of process steps and manufacturing time while maintaining protective functionality.
Solution Approach 2:
The copper layer is designed as a multi-functional element that simultaneously provides mechanical support, electrical connectivity, and thermal conduction. This universal component replaces several separate elements that would otherwise be required, streamlining the manufacturing process and reducing overall production time.
4Reliability
If DBC substrates with ceramic insulators are used, then electrical insulation is provided, but thermal dissipation efficiency must be optimized
Solution Approach 1:
The patent employs a composite structure combining ceramic insulating material with highly conductive copper layers. The ceramic provides electrical insulation between conductive paths, while the copper layers provide low-resistance thermal and electrical conduction pathways. This composite approach optimizes both electrical isolation and thermal management simultaneously.
Solution Approach 2:
The patent applies different material properties to different regions: ceramic material is used where electrical insulation is required, while copper material is used where thermal and electrical conduction is required. This localized optimization of material properties ensures that each region of the substrate performs its specific function with maximum efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the module's thickness, minimizes parasitic effects, and improves thermal dissipation, leading to higher integration density, reliability, and manufacturing efficiency while maintaining electrical insulation and thermal conductivity.
Implementation Method 1
The first coupling region is of a sintered thermoconductive paste and mechanically and thermally couples the first die to the first substrate. The second coupling region is also of sintered thermoconductive paste and mechanically, electrically, and thermally couples the one or more conduction terminals of the first electronic component to the first conductive path of the second substrate.
Implementation Method 2
sintered thermoconductive paste
Implementation Method 3
the intermediate ceramic layer guarantees good electrical insulation but at the same time enables good transfer of heat outwards
Implementation Method 4
replaces solder balls with silver-based coupling regions, and employing DBC technology with ceramic insulators and copper layers for enhanced thermal management
Data Source
AI summary
An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.