Transfer-Molded Power Module Leads Supported by Integrated Slots

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Solution Overview

Problem

Existing semiconductor device modules face issues with signal lead deformation or breakage during insertion into printed circuit boards, which is complicated by the use of guide parts and increases system costs.

Innovation Solution

The design includes a molded body with non-parallel side surfaces and slots, where signal leads with multiple bends, such as semicircular bends, are encapsulated, providing structural support during insertion and preventing deformation or breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If L-shaped signal leads are used to facilitate insertion into PCB, then ease of operation is improved, but reliability deteriorates due to deformation or breakage during insertion

Engineering Contradiction:

Improveease of insertionVSAvoidsignal lead integrity

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-forming multiple bends in the signal leads and positioning them within slots in the molded body before insertion. This pre-positioning provides structural support and guidance during the insertion process, preventing deformation or breakage while maintaining ease of installation.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If guide parts are used to prevent signal lead deformation, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvesignal lead protectionVSAvoidsystem integration complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the protective function previously requiring separate guide parts into the molded body structure itself. The slots are integrated directly into the molded body, eliminating the need for additional guide components while maintaining signal lead protection during insertion.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The molded body with integrated slots provides self-service protection for the signal leads. The structure automatically guides and protects the leads during insertion without requiring external guide parts or additional protective mechanisms.

Inventive Principle:

Principle #25Self-service

3Reliability

If guide parts are used to prevent signal lead breakage, then reliability is improved, but manufacturing cost increases

Engineering Contradiction:

Improvesignal lead integrityVSAvoidtotal system cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The protective function is merged into the molded body structure through integrated slots, eliminating the need for separate guide parts. This reduces component count and assembly steps, thereby lowering total system cost while maintaining signal lead integrity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20240030108A1Transfer molded power modules and methods of manufacture

Publication Date: 2024.01.25 SEMICON COMPONENTS IND LLC

AI summary

In a general aspect, an electronic device assembly includes a circuit including at least one semiconductor die, and a molded body encapsulating the circuit. The molded body has a primary surface arranged in a plane and a side surface that is non-parallel with the plane. The assembly also includes a slot defined in the primary surface of the molded body, and a signal lead extending out of the side surface of the molded body. The signal lead is electrically coupled with the circuit and has a plurality of bends that include a bend of that is at least partially disposed in the slot.