Power Module Assembly With Copper Heat Sink Solder Access
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Solution Overview
Problem
Conventional power control modules, such as Solid State Power Controller (SSPC) modules, face limitations in heat dissipation due to the thermal constraints of the printed wiring board (PWB) and inefficiencies in manufacturing processes for heat sinks.
Innovation Solution
The solution involves a power control module assembly where power devices are mounted on a copper plate heat sink instead of the PWB, with aligned access holes for soldering and push pins for assembly, allowing for improved heat dissipation and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power devices are mounted on a single PWB with traditional heat dissipation methods, then assembly is convenient, but thermal dissipation capability is limited
Solution Approach 1:
The patent transitions from two-dimensional heat dissipation on the PWB surface to three-dimensional heat dissipation using a heat sink structure that extends vertically from the PWB. The heat sink includes a base mounted on the PWB and fins extending upward, creating additional thermal dissipation pathways in the vertical dimension, thereby significantly improving thermal management capability.
Solution Approach 2:
The heat sink is segmented into multiple fins that are spaced apart from each other. This segmentation increases the total surface area available for heat dissipation and allows heat to be distributed across multiple discrete thermal pathways, improving overall thermal dissipation efficiency while maintaining structural integrity.
2Temperature
If conventional heat sink methods are used, then heat dissipation can be achieved, but manufacturing efficiency is reduced due to manual operations
Solution Approach 1:
The heat sink base is integrally formed with the PWB or securely mounted to it, merging the structural support function of the PWB with the thermal dissipation function of the heat sink. This integration eliminates separate manual assembly steps for attaching the heat sink to the board, thereby improving manufacturing efficiency while maintaining effective heat dissipation.
Solution Approach 2:
The patent introduces a mounting structure that serves as an intermediary between the PWB and the heat sink fins. This intermediary structure facilitates automated assembly by providing standardized attachment points and alignment features, enabling robotic or automated equipment to efficiently assemble the heat sink components without manual intervention.
3Device complexity
If access holes are not provided in the heat sink, then the structure remains simple, but soldering access during assembly is blocked
Solution Approach 1:
The heat sink base is segmented to include access holes that pass through it. These holes create openings in the otherwise solid structure, allowing soldering tools to access the connection points between the power devices and the PWB through the heat sink base, thereby enabling automated soldering processes without compromising the overall structural integrity of the heat sink.
Solution Approach 2:
The access holes are strategically positioned and sized to allow soldering tools to pass through the heat sink base and reach the solder joints on the PWB. This nested configuration enables the soldering process to occur through the heat sink structure itself, maintaining a compact design while providing necessary manufacturing access.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a 40% increase in thermal dissipation and allows for more power devices to be accommodated on a single PWB, enhancing current limiting capabilities during inrush events.
Implementation Method 1
a copper plate heat sink... results in a 40% increase in thermal dissipation
Data Source
Figure 1~2
AI summary
A power control module (102) includes a power device having a first side and a second side opposite from the first. The power control module includes a printed wiring board (PWB) (108) spaced apart from the first side of the power device. The PWB (108) is electrically connected to the power device. A heat sink plate (110) is soldered to a second side of the transistor (102) for heat dissipation from the transistor (102). The PWB (108) and/or the heat sink plate (110) includes an access hole defined therein to allow for access to the transistor (102) during assembly. A method of assembling a power control module includes soldering at least one lead of a power device to a printed wiring board (PWB) (108), pushing the power device toward a heat sink plate (110), and soldering the power device to the heat sink plate (110).