Power Module Assembly With Metal Clip for Solder Alignment
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Solution Overview
Problem
The existing power modules in hybrid and electric vehicles face alignment issues during soldering due to misalignment phenomena, leading to increased manufacturing defects and complexity, especially when mounted on inverter heat sinks, and require multiple soldering processes with high defect rates.
Innovation Solution
A power module design using a metal clip and preformed solders with an integrated soldering process, aided by a soldering jig, ensures precise alignment and simultaneous soldering of components, reducing the number of processes and components, and incorporating a heat dissipation path to improve thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a soldering method is used to mount the power module on the inverter heat sink, then the power module can be attached to the heat sink, but misalignment occurs during melting causing the power module to deviate from the design position
Solution Approach 1:
The patent applies preliminary action by pre-forming the solder into a specific shape and size before the soldering process. The preformed solder is placed in a soldering groove on the heat sink, creating a physical constraint that guides the power module into the correct position before melting occurs, thereby preventing misalignment and position deviation during the soldering process.
Solution Approach 2:
The patent introduces an intermediary element - the soldering groove - that acts as a mediator between the heat sink and the power module. This groove provides a physical guide and constraint system that ensures proper alignment during assembly, solving the misalignment problem without requiring complex positioning mechanisms.
2Ease of manufacture
If the soldering process is divided into primary and secondary processes, then each process can be optimized, but the defective rate increases due to multiple processes
Solution Approach 1:
The patent merges the primary and secondary soldering processes into a single integrated soldering operation. By using preformed solder with specific dimensional characteristics and placing it in a dedicated groove, both the attachment and alignment functions are achieved in one process, eliminating the need for multiple soldering steps and thereby reducing the cumulative defective rate.
3Adaptability or versatility
If multiple types of components are mounted on the power module, then the functionality is enhanced, but the manufacturing difficulty increases
Solution Approach 1:
The patent applies universality by designing the heat sink with a standardized soldering groove structure that can accommodate different types of components and power modules. The preformed solder approach provides a universal mounting solution that works across various component configurations, simplifying the manufacturing process despite the diversity of components involved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing defects, simplifies the assembly process, decreases the number of components and man-hours, and enhances thermal performance by maintaining consistent solder thickness and preventing misalignment, thus improving manufacturing yield and efficiency.
Implementation Method 1
chip solders are disposed between the circuit board and the chips, such that the circuit board and the chips are connected to each other by the chip solders
Implementation Method 2
clip solders are disposed between the chips and the metal clip, such that the chips and the metal clip are connected to each other by the clip solders
Implementation Method 3
The metal clip may be configured to dissipate heat of the chips
Data Source
AI summary
The present invention relates to a power module that is capable of decreasing the number of components and assembling man-hours by applying a metal clip and performing an integrated soldering process and is capable of keeping a thickness of a soldering part constant and preventing movement of chips at the time of soldering by using a soldering jig.