Double-Sided Cooling Power Module Solder Structure for Height Control
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Solution Overview
Problem
Conventional methods for controlling the height of double-sided cooling power modules fail to securely maintain the height of the solder compensation layer during the primary soldering process, leading to inconsistent height adjustments in subsequent soldering processes.
Innovation Solution
A soldering structure that includes a soldering target portion, a metal layer with a bonding surface, and at least one wire with a convex portion located within the bonding region. The wire supports the soldering target portion to maintain a predetermined height, ensuring proper interval formation for solder compensation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a large amount of solder is provided upon soldering to increase the height of the power module, then the height of the power module is increased, but the solder spreads around and lowers the height
Solution Approach 1:
A height adjustment member (wire) is introduced as an intermediary element between the lower substrate and the spacer. This wire with a convex portion acts as a physical mediator that prevents solder from spreading horizontally while allowing vertical height adjustment, thus resolving the contradiction between increasing height and maintaining height control precision
Solution Approach 2:
The wire with the convex portion is positioned in advance before soldering occurs. This preliminary placement of the height adjustment member establishes a predetermined height reference that guides the soldering process, ensuring that the solder compensation layer achieves the desired height without spreading, thereby maintaining manufacturing precision while enabling height adjustment
2Adaptability or versatility
If the solder compensation layer is manufactured at a predetermined height or higher, then height adjustment capability is improved, but the solder flows out horizontally due to part load, failing to secure the necessary height
Solution Approach 1:
The wire with the convex portion serves as a supporting intermediary that bears the load of the parts being soldered. By transferring the mechanical load to the wire rather than relying solely on the solder compensation layer, the structure maintains the predetermined height reliably even under part load conditions, preventing horizontal solder flow
Solution Approach 2:
The convex portion of the wire is designed in advance to provide structural support and cushioning during the soldering process. This pre-configured support structure prevents the solder compensation layer from collapsing or flowing horizontally under load, ensuring that the height adjustment capability is maintained with reliable height securing
3Ease of manufacture
If multiple soldering processes are applied to manufacture each part through primary and secondary soldering, then manufacturing flexibility is improved, but the desired height cannot be achieved in the secondary soldering process
Solution Approach 1:
The height adjustment member (wire with convex portion) is installed during the primary soldering process in advance, establishing a predetermined height reference before secondary soldering. This preliminary height establishment enables the secondary soldering process to achieve the desired final height with precision, maintaining both manufacturing flexibility and height accuracy
Solution Approach 2:
The soldering process is divided into primary and secondary stages, with the height adjustment member being installed in the primary stage. This segmentation allows each stage to have a specific function: primary soldering establishes the height reference, and secondary soldering achieves the final assembly, thereby maintaining manufacturing flexibility while ensuring desired height achievement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively secures the necessary height margin for height adjustments in the secondary soldering process, enabling uniform manufacturing of power modules with improved cooling performance and quality.
Implementation Method 1
a bonding surface having a bonding region in which the spacer is bonded by solder
Data Source
AI summary
In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.