Power Module Dual-Side Cooling via Soldered Interconnects
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Solution Overview
Problem
High voltage power modules face challenges in heat dissipation due to the thermal insulating nature of encapsulation materials, leading to increased component costs and parasitic impedances from wire-based interconnections, which impact performance and current carrying capacity.
Innovation Solution
The power module design includes exposed thermally conductive paths on both sides, using soldered conductive features and interconnect structures to facilitate heat removal, reducing thermal junction resistance and eliminating parasitic impedances associated with wire-bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire-based interconnections are used for high current interconnections, then cost is reduced, but parasitic impedances increase which adversely impact performance
Solution Approach 1:
The patent replaces wire-based mechanical interconnections with a direct soldered interconnect structure. The interconnect structure includes soldered conductive features that provide both mechanical support and electrical connection, eliminating the need for separate wire bonds. This substitution reduces parasitic impedances while maintaining cost-effectiveness through integrated construction.
2Reliability
If encapsulation material is used to provide unexposed structure, then electrical insulation is improved, but thermal conduction deteriorates leading to increased thermal junction coefficient
Solution Approach 1:
The patent applies local quality by creating selective exposure of the interconnect structure at specific locations (first and second exposed surfaces) while maintaining encapsulation in other areas. This allows thermal conduction paths to be exposed where needed for heat dissipation, while electrical insulation is preserved through encapsulation in non-thermal-critical areas. The interconnect structure itself provides the thermally conductive path through its metal construction.
3Temperature
If exposed ceramic substrate is used to increase heat dissipation, then thermal junction coefficient is reduced, but module cost increases
Solution Approach 1:
The patent makes the interconnect structure multi-functional by having it serve both as an electrical connection element and as a thermally conductive path. The same soldered interconnect structure that provides electrical connectivity also conducts heat away from the device die, eliminating the need for separate ceramic substrate materials. This reduces module cost while maintaining improved thermal performance.
4Temperature
If direct bonded copper approach is used, then thermal junction coefficient is reduced, but manufacturing complexity and substrate cost increase
Solution Approach 1:
The patent merges the interconnect structure with the thermal management function by having the same soldered conductive features serve dual purposes: electrical connection and heat dissipation. This consolidation eliminates the need for separate DBC (direct bonded copper) substrate construction, reducing manufacturing complexity and substrate costs while achieving the same thermal junction coefficient improvement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat removal efficiency, increases current carrying capacity, and reduces component costs by providing a thermally conductive path for heat dissipation from both sides of the power module, improving performance and reliability.
Implementation Method 1
heat removal is accomplished by thermal conduction through an external heatsink bolted or otherwise mounted onto the integrated power module package to dissipate heat from one face of a switch component die through a substrate which is connected to the heatsink
Implementation Method 2
The first body opening in disclosed examples provides an externally accessible first exposed surface to provide a thermally conductive path to draw heat away from the first side of the device die or dies. In addition, the second opening provides an externally accessible second exposed surface of the device die to draw heat away from the second side of the device die
Data Source
AI summary
Disclosed examples include power modules and fabrication methods therefor in which one or more power device dies include a switching device and a second device die with a circuit component are mounted to a lead frame or other interconnect structure on a substrate structure, and a body structure is formed around portions of the power module providing a first opening to expose a portion of the substrate structure to provide an externally accessible first exposed surface along the top of the power module, and the body structure includes a second opening exposing a portion of the first device die along the bottom of the power module to provide a thermally conductive path to draw heat away from the power device dies.