Power Module Package Structure With Conductive Spacer Cooling
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Solution Overview
Problem
Existing semiconductor power devices face challenges in thermal performance, leading to increased failure rates when components are heated above certain temperatures, and there is a need for systems and methods to improve reliability, performance, and cost-effectiveness.
Innovation Solution
A package design that includes a semiconductor die thermally coupled to a high voltage isolation carrier, with a conductive spacer thermally coupled to both the semiconductor die and another high voltage isolation carrier, and a molding material encapsulating the components to enhance thermal management and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor power devices are operated at high temperatures, then power output increases, but failure rate increases
Solution Approach 1:
The package structure segments the thermal management function by introducing a dedicated conductive spacer component that is thermally coupled to both the semiconductor die and the carrier, creating a separate thermal conduction path that isolates the die from excessive heat accumulation while maintaining high power operation
Solution Approach 2:
The conductive spacer acts as a thermal intermediary between the semiconductor die and the carrier, facilitating controlled heat transfer from the die to the carrier while preventing direct thermal contact that would lead to overheating and failure, thus enabling high power operation with improved reliability
2Reliability
If thermal management is improved by adding components, then reliability increases, but device complexity increases
Solution Approach 1:
The conductive spacer is designed to perform multiple functions simultaneously: it provides thermal conduction from the die to the carrier, serves as a mechanical support structure, and acts as an electrical isolation element, thereby improving reliability without proportionally increasing device complexity
Solution Approach 2:
The patent merges the thermal management function with the existing package structure by integrating the conductive spacer into the carrier assembly, combining thermal conduction, mechanical support, and electrical isolation functions into a unified structure rather than adding separate components for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed package design improves thermal management and electrical performance of semiconductor power devices, enhancing reliability and reducing failure rates, while maintaining low costs and high performance.
Implementation Method 1
The conductive spacer is thermally coupled to semiconductor die and to the second high voltage isolation carrier
Implementation Method 2
The molding material encapsulates the semiconductor die and the conductive spacer
Data Source
AI summary
In a general aspect, a package includes a semiconductor die disposed between a first high voltage isolation carrier and a second high voltage isolation carrier. The semiconductor die is thermally coupled to the first high voltage isolation carrier. The package also includes a molding material disposed in a space between the semiconductor die and the first high voltage isolation carrier, and a conductive spacer disposed between the semiconductor die and the second high voltage isolation carrier. The conductive spacer is thermally coupled to semiconductor die and to the second high voltage isolation carrier. A longitudinal dimension of the conductive spacer is greater than a longitudinal dimension of the semiconductor die. The molding material encapsulates the semiconductor die and the conductive spacer.