Semiconductor Power Module Spacer Elements for Contact Spacing

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Solution Overview

Problem

Existing power semiconductor modules lack a defined block size due to a free gap distance between the load connection element and the molded insulating body, resulting in inconsistent contact spacing of the contact feet with the module plate element.

Innovation Solution

Incorporation of spacer elements to maintain a defined distance between the load connection element and the molded insulating body, ensuring precise contact spacing and a defined block dimension through the use of nubs, spring bars, or curved spacer strips with limited resilience.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the load connection element is positioned with a free gap distance from the molded insulating body, then the assembly is simpler to manufacture, but the contact spacing of the contact feet becomes inconsistent and undefined

Engineering Contradiction:
Improvecontact spacing precisionVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces spacer elements as intermediary components between the load connection element and the molded insulating body. These spacers act as mediators that define and maintain a precise block dimension, ensuring consistent contact spacing of the contact feet with the module plate element while eliminating the free gap distance present in conventional designs.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the dimensional parameter by defining a specific block dimension through the spacer elements. This parameter change transforms the undefined free gap distance into a precisely controlled dimension, thereby improving contact spacing precision without significantly complicating the overall structure.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If spacer elements are added to define the block dimension, then the contact spacing precision is improved, but the device complexity increases

Engineering Contradiction:
Improveblock dimension definitionVSAvoidcomponent quantity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The spacer elements serve as simple intermediary components that provide the necessary dimensional definition. Rather than redesigning the entire assembly, the spacers are added as straightforward positional references that maintain the block dimension, minimizing the increase in device complexity while achieving precise contact spacing.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Length of stationary object

If the strip section is positioned closer to the molded insulating body, then the block dimension is reduced, but the contact spacing consistency deteriorates

Engineering Contradiction:
Improveblock dimensionVSAvoidcontact spacing consistency
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

The spacer elements are positioned between the strip section and the molded insulating body to maintain a defined block dimension. This intermediary positioning ensures that the contact feet achieve consistent contact spacing with the module plate element, regardless of the overall block dimension size.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of spacer elements ensures a consistent and precise contact spacing between the contact feet and the module plate element, enhancing the structural integrity and reliability of the power semiconductor module by maintaining a defined block dimension.

Implementation Method 1

The spacer elements have limited resilience and are designed to maintain a defined block dimension between the molded insulating body and the strip section of the load connection element

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentEP1930945B1Semiconductor power module
Publication Date: 2009.05.20 SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG
  • EP1930945B1 patent drawingFigure 1~2
  • EP1930945B1 patent drawingFigure 3~5
  • EP1930945B1 patent drawingFigure 6~8

AI summary

A power semiconductor module (10) is described, comprising a housing (12) and at least one module plate element (14), which is equipped with semiconductor devices (26) and pressure-contacted with load and auxiliary connection elements (30 and 32). The load connection elements (30) have strip sections (34) arranged one above the other and electrically insulated from each other, and contact feet (36) projecting from these, which extend through recesses (40) formed in an insulating body (42). The contact feet (36) are pressure-contacted with the at least one module plate element (14). To achieve a defined block dimension of the contact feet (36) in relation to the insulating body (42), the strip section (34) of the load connection element (30) adjacent to the insulating body (42) is spaced from the insulating body (42) by spacer elements (48).