Power Module Spacer Layout for Multi-Chip Compatibility
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Solution Overview
Problem
Existing semiconductor power modules are designed specifically for particular chip sizes and contact arrangements, making it impossible to use different chips without significant changes to the manufacturing process, leading to increased costs and time due to supply difficulties and chip model changes.
Innovation Solution
A power module design that incorporates an insulating wedge within the housing accommodation to accommodate chips of different dimensions and contact arrangements, allowing for compatibility with various chip models without requiring extensive modifications to the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If power modules are designed specifically for given chips with fixed dimensions and contact arrangements, then the electrical connection and module performance are optimized, but the adaptability to different chip models is lost and manufacturing process changes are required when switching chip suppliers
Solution Approach 1:
The housing is designed with a universal structure that can accommodate different chip models through adjustable support elements. The support elements can be repositioned or replaced to match various chip dimensions and contact arrangements, allowing a single housing design to serve multiple chip types without requiring complete module redesign
Solution Approach 2:
The module incorporates adjustable and reconfigurable support elements that can be dynamically repositioned within the housing. These supports can be moved to different locations or configured in various arrangements to adapt to different chip geometries and contact patterns, enabling the same housing to accommodate multiple chip variants
2Manufacturing precision
If the manufacturing process is thoroughly reviewed and modified when changing chip models, then the module can be optimized for new chips, but significant manufacturing delays and additional costs are generated
Solution Approach 1:
The housing is pre-configured with multiple support element positions and adjustment mechanisms during the design phase. This preliminary preparation allows quick adaptation to different chip models without requiring extensive manufacturing process revisions, as the structural flexibility is already built into the housing design
Solution Approach 2:
The support structure is divided into modular, independently adjustable elements rather than a fixed monolithic structure. This segmentation allows individual support elements to be repositioned or modified without affecting the entire housing, enabling precise adaptation to different chips while minimizing manufacturing changes
3Reliability
If screen-printed electrical traces are designed to match specific contact arrangements, then electrical connection reliability is improved, but the module cannot accommodate chips with different contact patterns
Solution Approach 1:
Adjustable support elements serve as intermediaries between the fixed housing structure and the variable chip contact arrangements. These supports can be repositioned to align with different contact patterns on various chips, maintaining reliable electrical connections without requiring changes to the screen-printed traces on the housing
Data Source
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AI summary
Power module (1) comprising: - A first housing element (10) having a first slot (12) for receiving a first chip (70; 70'; 70"), - a first chip (70; 70'; 70") at least partially received in the first slot, having electrical contacts (71, 72, 73; 71', 72', 73'; 71", 72", 73"), - connector elements (41, 43, 45) electrically connected to the electrical contacts of the first chip, - at least one insulating spacer (90; 90'; 90") disposed at least partially in the first slot so as to at least partially cover said chip, having at least one opening (91, 92; 91', 92'; 91", 92") providing access to at least one electrical contact of the chip through the spacer and/or at least one trace (97") ensuring the connection with one of the connector elements and/or a capacity.