Power Electronic Module Spring Element Cooling
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Solution Overview
Problem
Existing power electronic modules are sensitive to thermal fatigue, difficult to maintain, and limited in adding new components due to metal wiring cables and complex assembly, with high manufacturing costs and parasitic inductances.
Innovation Solution
A power electronic module with semiconductor components connected to an electrical support via retractable electrically conductive spring elements, which also serve as a cooling device, eliminating the need for metal wiring cables and simplifying maintenance and component replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal wiring cables are used to connect power semiconductor components to the substrate, then electrical connection is achieved, but parasitic inductances are introduced and reliability is reduced
Solution Approach 1:
The patent extracts and removes the metal wiring cables from the module architecture. Power semiconductor components are directly mounted onto the substrate without intermediate wiring cables, eliminating the source of parasitic inductances while maintaining electrical connection through direct bonding techniques
Solution Approach 2:
The patent merges the function of electrical connection and mechanical support into a single direct bonding interface. The power semiconductor components are directly bonded to the substrate, combining the electrical connection function previously provided by wiring cables with the mechanical support function, thereby eliminating parasitic inductances
2Ease of repair
If power semiconductor components are assembled with interconnection seals and wiring cables, then electrical connection is established, but component replacement and maintenance become difficult
Solution Approach 1:
The patent segments the module into independently replaceable power semiconductor components directly mounted on the substrate. Each component can be individually removed and replaced without affecting other components, simplifying maintenance while reducing assembly complexity through standardized direct bonding interfaces
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical connection, and thermal management. The direct bonding interface enables the substrate to universally accommodate different power semiconductor components without requiring complex interconnection seals or wiring cable assemblies
3Reliability
If different layers and materials are used in the substrate structure, then functional requirements are met, but thermal fatigue sensitivity increases
Solution Approach 1:
The patent changes the material parameter selection for the substrate, choosing materials with matched thermal expansion coefficients for layers that are in thermal contact. This reduces thermal fatigue sensitivity while maintaining functional adaptability through the versatile direct bonding interface that can accommodate various power semiconductor component types
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances reliability and maintainability by reducing parasitic inductances and thermal fatigue, allowing for easy addition of components across various power ranges with reduced manufacturing costs and simplified cooling systems.
Implementation Method 1
each component being further mounted on the electrical support via at least one electrically conductive spring element
Implementation Method 2
a cooling device in thermal contact with each component
Data Source
AI summary
Power electronic module comprising a plurality of semiconductor power electronic components electrically connected to an electrical support, and a cooling device in thermal contact with each component, each component being present between the electrical support and the cooling device and being mounted on the electrical support via at least one electrically conductive spring element.