Power Semiconductor Module Terminal Structure for Thermal Stress Relief
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Solution Overview
Problem
Existing power semiconductor modules face challenges in efficient heat dissipation and stress mitigation due to temperature-related expansion and contraction differences between the module and the circuit board, leading to increased external forces and potential damage.
Innovation Solution
The power semiconductor module design includes first and second terminals with specific geometric configurations that allow for efficient mounting on a circuit board, reducing external forces and stress, and incorporates a heat dissipating member and a sheet member for effective heat transfer to a heat dissipator, while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power semiconductor module is mounted on a circuit board, then electrical connection and support are achieved, but temperature-related expansion and contraction differences generate external forces and stress that can cause damage
Solution Approach 1:
A solder layer is introduced as an intermediary between the terminal and the circuit board mounting surface. This solder layer acts as a stress-absorbing buffer that accommodates thermal expansion and contraction differences between the module and circuit board, reducing the transmission of external forces to the semiconductor elements while maintaining reliable electrical and mechanical connection.
2Ease of manufacture
If the terminal is designed with a simple straight structure, then manufacturing is easier, but stress from thermal expansion is not effectively mitigated and mounting flexibility is reduced
Solution Approach 1:
The terminal is designed with a bent structure featuring multiple portions (first, second, third portions) at different angles rather than a rigid straight configuration. This dynamic geometry allows the terminal to flex and absorb thermal stress during expansion and contraction cycles, while the bent shape can be manufactured using standard forming processes, maintaining ease of production.
Solution Approach 2:
The terminal incorporates curved and angled portions instead of straight lines, creating a flexible geometric profile that can bend to accommodate thermal stresses. The curved sections act as stress-relief zones that absorb expansion forces while maintaining structural integrity and electrical connectivity.
3Temperature
If heat dissipation structures are added to the power semiconductor module, then thermal management improves, but the module size and mounting area increase
Solution Approach 1:
The heat dissipating member is integrated directly into the module body structure, merging the thermal management function with the structural housing. This combination eliminates the need for separate external heat sinks or additional mounting hardware, achieving effective heat dissipation while maintaining a compact footprint and minimal mounting area.
Solution Approach 2:
The module body is designed to serve multiple functions simultaneously: it provides structural support, electrical insulation, and heat dissipation through an integrated heat dissipating member. This multi-functionality reduces the overall component count and mounting space requirements while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates reduced external forces, efficient heat dissipation, and stress mitigation, enabling the module to operate effectively while minimizing size and mounting area, thus enhancing reliability and performance.
Implementation Method 1
a heat dissipating member (50) on the body main surface (20s)... effective heat transfer to a heat dissipator
Data Source
AI summary
A power semiconductor module includes a first terminal which protrudes from a first body side surface of a module body, and a second terminal which protrudes from a second body side surface. The first terminal includes a first portion which protrudes from the first body side surface, a second portion which extends the first portion beyond a body rear surface on the reverse side from from a body main surface, and a third portion which extends from the second portion. The second terminal includes a first portion which protrudes from the second body side surface, a second portion which extends from the first portion beyond the body rear surface on the reverse side from the body main surface, and a third portion which extends from the second portion.