Power Module Substrate Insulating Resin Layer High Temperature Reliability
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Solution Overview
Problem
Existing power modules fail to maintain sufficient insulation properties at high temperatures, leading to performance degradation.
Innovation Solution
A substrate for power modules is developed with a metal substrate, an insulating resin layer containing thermosetting resin and inorganic fillers, which has a dielectric loss ratio of 0.030 or less at 1 kHz and 100° C. to 175° C., and a relative permittivity change of 0.10 or less, enhancing thermal conduction and insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal-based circuit boards are used to improve heat dissipation, then heat dissipation performance is improved, but insulation properties deteriorate at high temperatures
Solution Approach 1:
The patent employs a composite insulating resin layer combining thermosetting resin with inorganic fillers (alumina, silica, or boron nitride). This composite structure provides both thermal conduction pathways through the inorganic particles and electrical insulation through the resin matrix, resolving the contradiction between heat dissipation and insulation properties in metal-based power module substrates.
Solution Approach 2:
The patent specifies precise parameter ranges for the insulating resin layer: dielectric loss ratio of 0.030 or less at 1 kHz and 100°C to 175°C, and relative permittivity change of 0.10 or less. By controlling these parameters through selective use of thermosetting resin and inorganic filler combinations, the material maintains stable insulation properties across the operating temperature range while providing adequate heat dissipation.
2Reliability
If thermosetting resin with inorganic fillers is used to maintain insulation properties, then insulation reliability is improved, but dielectric loss increases at high temperatures
Solution Approach 1:
The patent controls dielectric loss by selecting specific thermosetting resin formulations and inorganic filler types, achieving a dielectric loss ratio of 0.030 or less at 1 kHz and 100°C to 175°C. This parameter control ensures minimal energy loss while maintaining insulation reliability through the stable crosslinked structure of the thermosetting resin and the low-loss properties of the inorganic fillers.
Solution Approach 2:
The composite structure of thermosetting resin and inorganic fillers creates a material where the resin matrix provides electrical insulation with low dielectric loss, while the inorganic fillers provide thermal conduction. This division of functional roles allows simultaneous achievement of insulation reliability and low dielectric loss at elevated temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides power modules with excellent insulation reliability and improved heat dissipation, effectively suppressing insulation degradation at high temperatures.
Implementation Method 1
an insulating resin layer provided on the metal substrate... enhancing thermal conduction and insulation reliability
Implementation Method 2
a maximum value of a dielectric loss ratio of the insulating resin layer at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10
Data Source
AI summary
A substrate for a power module (100) of the present invention includes a metal substrate (101), an insulating resin layer (102) provided on the metal substrate (101), and a metal layer (103) provided on the insulating resin layer (102). The insulating resin layer (102) includes a thermosetting resin (A) and inorganic fillers (B) dispersed in the thermosetting resin (A), a maximum value of a dielectric loss ratio of the insulating resin layer (102) at a frequency of 1 kHz and 100° C. to 175° C. is equal to or less than 0.030, and a change in a relative permittivity is equal to or less than 0.10.