Power Module Substrate Positioning via Saturated Fatty Acid
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Solution Overview
Problem
Existing methods for manufacturing power-module substrates face issues with sideways slip and position shift during assembly, leading to compromised heat radiation properties due to inadequate adhesion between metal and ceramic components.
Innovation Solution
A manufacturing method involving the use of a temporary fixing material with saturated fatty acid, which is melted and solidified to temporarily join metal and ceramic components, preventing position shift and ensuring accurate positioning during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If metal plates are directly stacked without temporary fixing material, then the manufacturing process is simple, but position shift occurs during assembly leading to deterioration of heat radiation property
Solution Approach 1:
A temporary fixing material is introduced as an intermediary substance between metal plates to prevent sideways slip during assembly. This mediator material is applied in advance, allowing precise positioning without complex pressurizing tools or fixtures, thereby improving laminating position precision while maintaining process simplicity.
Solution Approach 2:
The temporary fixing material is applied to the metal plate surface before stacking and assembly operations. This preliminary action ensures that position shift is prevented from the outset during subsequent handling and assembly processes, eliminating the need for complex positioning fixtures and tools.
2Reliability
If octanediol is used as temporary fixing material, then adhesion is provided, but sideways slip still occurs because adhesion is not enough
Solution Approach 1:
The patent changes the physical and chemical parameters of the temporary fixing material by selecting substances with appropriate melting points, viscosities, and adhesion characteristics. The material parameters are optimized to provide sufficient adhesion strength while maintaining ease of application and removal, thereby achieving both reliable adhesion and precise positioning.
3Strength
If metal plates are stacked with pressing force, then joining is achieved, but position shift occurs during pressurizing
Solution Approach 1:
The temporary fixing material is applied to the metal plate surface before stacking and pressurizing operations. This preliminary action creates a protective layer that prevents sideways slip during pressurizing, allowing the application of necessary pressing force to achieve strong joining without compromising laminating position precision.
Solution Approach 2:
The temporary fixing material serves as a mediator between the metal plates during pressurizing. It distributes the pressing force evenly and prevents direct sliding contact between plate surfaces, thereby maintaining positioning precision while achieving the required joining strength through pressurizing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents position shift between joining surfaces, enhancing the precision and productivity of power-module substrate manufacturing while maintaining good bondability and heat radiation properties.
Implementation Method 1
stacking and positioning the first member and the second member with the temporary fixing material therebetween in a state in which the temporary fixing material is melted
Implementation Method 2
cooling the temporary fixing material to form the laminated body in which the stacked first member and the second member are temporarily joined
Implementation Method 3
joining step forming a joined body in which the first member and the second member are joined by heating with pressurizing the laminated body in a stacking direction
Data Source
AI summary
A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.


