Power Module Substrate Segmentation for Expanded Configuration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional non-insulated-type power modules face challenges in expanding their structure design beyond 1-in-1 or 2-in-1 configurations due to complex lead frame configurations, deteriorated heat-radiation properties, and reduced reliability, especially when attempting to achieve 4-in-1 or 6-in-1 structures, and require multiple processes including wire bonding.
Innovation Solution
The application of dielectric material coating to areas other than SMT areas and inserting dielectric material between lead frame patterns to create an integrated structure, allowing for 2-in-1, 4-in-1, or 6-in-1 semiconductor mounting on a single substrate, with embossed and engraved patterns on substrates for direct semiconductor mounting and simplified vertical connections, and using a dielectric layer with epoxy and ceramic for improved thermal conductivity and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional non-insulated-type power module uses single lead frame, then structure is simple, but structure design cannot be expanded to 4-in-1 or 6-in-1 configuration
Solution Approach 1:
The power module structure is segmented into multiple independent substrate units (1-in-1, 2-in-1, 4-in-1, or 6-in-1 configurations) that can be combined through standardized lead frame connections. Each substrate can be designed independently with its own circuit patterns, allowing flexible expansion from single to multi-configuration layouts without redesigning the entire lead frame system.
Solution Approach 2:
The lead frame is designed with universal connection interfaces that can accommodate different substrate configurations (1-in-1, 2-in-1, 4-in-1, 6-in-1). The same lead frame structure serves multiple functions by supporting various semiconductor mounting arrangements, enabling scalability without increasing overall system complexity.
2Stability of the object's composition
If conventional non-insulated-type power module uses multi-layered solder structure with spacer, then structure is stable, but reliability is reduced
Solution Approach 1:
The spacer component is extracted and removed from the module structure. Instead of using multi-layered solder structures with spacers, the invention employs direct soldering of substrates to the lead frame, eliminating the spacer and reducing the number of interfaces that could fail, thereby improving reliability while maintaining structural stability.
3Ease of manufacture
If conventional non-insulated-type power module applies wire bonding, then electrical connection is achieved, but process complexity increases and reliability must be ensured
Solution Approach 1:
The electrical connection function is merged with the mechanical support structure. Instead of separate wire bonding processes, the invention uses direct solder connections that simultaneously provide both mechanical support and electrical connectivity, reducing process complexity and eliminating the need for additional wire bonding steps.
4Reliability
If conventional non-insulated-type power module uses insulated-type two-layered TIM and one-layered Si3N4 ceramic substrate, then insulation is provided, but heat-radiation property deteriorates
Solution Approach 1:
The invention uses composite material structures for substrates that combine insulating properties with enhanced thermal radiation capabilities. The substrate materials are designed to provide both electrical insulation and improved heat dissipation, replacing the conventional combination of TIM layers and ceramic substrates with integrated composite solutions that address both insulation and heat-radiation requirements simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the power module to achieve expanded structure designs with enhanced heat-radiation and insulation properties, improved reliability, and simplified processes, while eliminating the need for conventional thermal greases and spacers, resulting in improved cooling performance.
Implementation Method 1
using a dielectric layer with epoxy and ceramic for improved thermal conductivity and insulation
Implementation Method 2
dielectric material coating is applied to an area other than a Surface Mount Technology (SMT) area and a dielectric material is inserted in a pore between lead frame patterns
Data Source
AI summary
A power module includes an upper substrate comprising a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; a lower substrate including a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; and a semiconductor element having an upper terminal and a lower terminal, the upper terminal and the lower terminal being bonded to a lower surface of the upper substrate and an upper surface of the lower substrate, respectively.