Multi-Die Power Module Temperature Control via Duty Cycle Balancing

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Solution Overview

Problem

Multi-die power modules face non-uniform temperature distribution due to geometric and electrical parameter variations, limiting power dissipation and causing unequal aging of dies, which reduces the effectiveness of parallel devices.

Innovation Solution

A closed-loop temperature control system that determines and compares weighted arithmetic means of junction temperatures across dies, adjusting the duty cycle of input signals to balance temperatures and ignore faulty dies, thereby stabilizing die temperatures without additional sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If multiple dies are used in parallel to achieve high current rating, then the power handling capability is improved, but the temperature distribution becomes non-uniform causing unequal aging and limiting total power dissipation

Engineering Contradiction:
Improvepower handling capabilityVSAvoidtemperature uniformity
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The control system applies different duty cycles to different dies based on their individual temperature conditions. The controller monitors junction temperatures of each die and selectively adjusts the duty cycle for each die to balance the temperature distribution across the parallel-connected dies, thereby achieving uniform temperature while maintaining high power handling capability

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system dynamically changes the duty cycle parameter for each die based on real-time temperature measurements. By adjusting the duty cycle of the input signal applied to each die, the controller modifies the power dissipation of individual dies to achieve uniform temperature distribution across all parallel dies

Inventive Principle:
Principle #35Parameter changes

2Duration of action of stationary object

If temperature control is implemented to balance die temperatures, then the lifespan of the power module is improved, but the controller complexity increases due to the need for closed-loop control

Engineering Contradiction:
ImprovelifespanVSAvoidcontroller complexity
Core Design Contradiction:
Duration of action of stationary objectVSDevice complexity

Solution Approach 1:

The control system implements closed-loop temperature control by continuously monitoring the junction temperatures of parallel-connected dies and adjusting their duty cycles accordingly. The controller compares the measured temperatures with reference values and modifies the input signals to each die to maintain uniform temperature distribution, thereby extending module lifespan while managing complexity through systematic feedback control

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The control system divides the temperature control task into individual die-level control actions. Each die is controlled independently based on its own temperature measurements, allowing the system to manage complexity by handling each die separately rather than treating the parallel structure as a single unit

Inventive Principle:
Principle #1Segmentation

3Reliability

If the duty cycle is adjusted to reduce hot spot temperatures, then the temperature uniformity is improved, but the response time to load changes may be affected

Engineering Contradiction:
Improvetemperature uniformityVSAvoidresponse time
Core Design Contradiction:
ReliabilityVSSpeed

Solution Approach 1:

The control system employs periodic sampling of junction temperatures and iterative adjustment of duty cycles. The controller continuously monitors temperature changes and makes incremental adjustments to duty cycles in successive control cycles, allowing the system to achieve temperature uniformity while responding to load changes through repeated measurement and adjustment cycles

Inventive Principle:
Principle #19Periodic action

Data Source

PatentUS10848052B2Device and method for controlling temperature of multi-die power module
Publication Date: 2020.11.24 MITSUBISHI ELECTRIC CORP
  • US10848052B2 patent drawing
  • US10848052B2 patent drawing
  • US10848052B2 patent drawing

AI summary

The present invention concerns a method for controlling the temperature of a multi-die power module, comprising:determining and memorizing a first weighted arithmetic mean of junction temperatures of the dies of the multi-die power module,determining successively another weighted arithmetic mean of junction temperatures of the dies,checking if the difference between the other weighted arithmetic mean and the memorized weighted arithmetic mean is lower than a first predetermined value,enabling a modification of the duty cycle of an input signal to apply to at least one selected die of the multi-die power module if the difference is lower than a first predetermined value,disabling a modification of the duty cycle of the input signal to apply to the at least one die of the multi-die power module if the difference is not lower than the first predetermined value.