Power Module Temperature Sensing via Conductive Structure Overlap
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Solution Overview
Problem
Conventional power modules in electronic devices with liquid cooling have low accuracy in determining over-temperature protection due to temperature discrepancies between the heat sink and the power semiconductor, leading to potential missed protection and complex assembly requirements.
Innovation Solution
A temperature sensor is disposed on the substrate surface, overlapping with a conductive structure connected to the heat-emitting component, allowing accurate temperature collection without the need for additional heat sink designs, simplifying assembly and reducing safety isolation issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a plug-in temperature-sensitive resistor is fastened onto the heat sink by using a locking structure, then the temperature sensor can collect heat sink temperature, but the assembly complexity increases and safety isolation difficulty arises
Solution Approach 1:
The temperature sensor is extracted from the heat sink structure and relocated to the substrate surface, eliminating the need for locking structures and complex assembly while maintaining temperature monitoring capability through conductive structure contact
Solution Approach 2:
The conductive structure serves as an intermediary between the heat-emitting component and the temperature sensor, enabling temperature collection without direct heat sink-sensor contact, thus simplifying assembly and improving safety isolation
2Measurement precision
If the temperature sensor is placed on the heat sink, then heat exchange temperature can be monitored, but the temperature reading does not accurately reflect the power semiconductor temperature due to liquid cooling plate influence
Solution Approach 1:
The conductive structure on the substrate acts as an intermediary that thermally couples the temperature sensor to the heat-emitting component, providing accurate temperature readings that reflect actual component temperature rather than heat sink temperature influenced by liquid cooling
Solution Approach 2:
The mechanical coupling method is replaced by thermal conduction through the conductive structure, allowing the temperature sensor to accurately detect heat-emitting component temperature without mechanical attachment to the heat sink
3Measurement precision
If additional heat sink designs are implemented to accommodate the temperature sensor, then temperature collection can be achieved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The temperature sensor is merged with the substrate structure, utilizing the existing conductive structures on the substrate for thermal coupling, thereby eliminating the need for additional heat sink designs and simplifying manufacturing
Solution Approach 2:
The substrate's conductive structures serve dual functions: electrical connection and thermal conduction for temperature sensing, eliminating the need for separate heat sink modifications and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high accuracy in determining over-temperature protection by minimizing the impact of liquid cooling plate temperature fluctuations and simplifies assembly, enhancing safety and flexibility in temperature monitoring.
Implementation Method 1
the conductive structure is configured to perform heat exchange with the heat-emitting component electrically connected to the conductive structure
Data Source
Figure 1
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AI summary
Embodiments of this application provide a power module, a charging pile, and a power supply. The power module includes a substrate, a heat-emitting component, and a température sensor. The heat-emitting component and the température sensor are both disposed on a surface of the substrate, and the heat-emitting component and the température sensor are insulated from each other. The substrate includes a conductive structure, the heat-emitting component is electrically connected to the conductive structure, and the conductive structure is configured to perform heat exchange with the heat-emitting component electrically connected to the conductive structure. A projection of the température sensor in a thickness dimension of the substrate overlaps at least partially with a projection of the conductive structure in the thickness dimension of the substrate, and the température sensor is configured to collect a température of the conductive structure. In this way, whether an electronic device such as a charging pile or a power supply needs over-temperature protection may be determined based on the température that is of the conductive structure and that is less affected by a liquid cooling plate, thereby improving determining accuracy.