Power Module Junction Temperature Sensing via Conductive Overlay
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power modules lack a direct and efficient method for temperature sensing, relying on indirect methods that increase operational costs and limit reliability and safety.
Innovation Solution
The implementation of conductive overlays with directly mounted temperature sensors provides a fast and accurate method for temperature measurement, enhancing the reliability and safety of power module operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If indirect temperature sensing methods are used in existing power modules, then the device complexity is reduced, but the measurement precision and reliability deteriorate
Solution Approach 1:
The patent merges the temperature sensing function directly into the power module structure by integrating a temperature sensor with the power transistor package. This consolidation eliminates the need for separate indirect sensing systems, thereby improving measurement precision while maintaining acceptable device complexity through functional integration.
Solution Approach 2:
The patent introduces a thermal coupling mechanism as an intermediary between the power transistor junction and the temperature sensor. This intermediary enables direct thermal contact, allowing the sensor to accurately measure junction temperature without requiring complex indirect measurement systems, thus resolving the contradiction between measurement accuracy and system simplicity.
2Reliability
If indirect temperature sensing methods are employed, then the ease of manufacture is improved, but the reliability and safety deteriorate
Solution Approach 1:
By combining the temperature sensor and power transistor into a single integrated package, the patent improves reliability through direct junction temperature monitoring while maintaining ease of manufacture through standardized packaging processes. The integration is achieved using conventional semiconductor manufacturing techniques that do not significantly complicate the fabrication process.
3Productivity
If direct temperature measurement is implemented, then the productivity of temperature monitoring is improved, but the device complexity increases
Solution Approach 1:
The patent uses a thermally conductive intermediary structure that couples the power transistor junction directly to the temperature sensor. This intermediary enables fast thermal response and high-speed temperature monitoring while keeping the structural complexity manageable through optimized thermal path design that leverages existing module architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables direct temperature measurement, improving the reliability and safety of power modules by providing accurate and timely temperature data for operational control.
Implementation Method 1
a temperature sensor coupled to a top surface of the conductive overlay to provide a direct temperature measurement for the one or more power transistors
Data Source
AI summary
Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay. A temperature sensor is physically bonded to a top surface of the conductive overlay to provide a direct temperature measurement for the one or more power transistors.