Primary-Formed Terminal Structure for Cooler Power Modules
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Solution Overview
Problem
Existing power semiconductor modules face challenges in improving electrical and thermal properties, particularly in small-scale production, where traditional metal forming processes like stamping and bending are costly and limit flexibility in shaping terminal structures.
Innovation Solution
The use of primary forming processes such as casting, sintering, and 3D printing to create complex terminal structures with enhanced electrical conductors, allowing for improved thermal and electrical performance, reduced tooling costs, and increased surface area for convective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional metal forming processes (stamping and bending) are used to create terminal structures, then manufacturing precision and structural strength are improved, but tooling costs increase and flexibility for small-scale production decreases
Solution Approach 1:
The patent changes the manufacturing process parameters from traditional metal forming (stamping and bending) to additive manufacturing (3D printing). This parameter change enables complex terminal structure geometries to be produced without expensive tooling, providing both manufacturing precision and flexibility for small-scale production runs.
Solution Approach 2:
The patent replaces the mechanical stamping and bending system with an additive manufacturing system. This substitution eliminates the need for costly metal forming tools while maintaining the ability to produce precise terminal structures with complex geometries, especially beneficial for low-volume production.
2Reliability
If complex terminal structure geometries are designed to improve electromagnetic behavior and heat dissipation, then electrical and thermal performance are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent uses additive manufacturing to replace traditional mechanical forming processes. This enables the creation of complex terminal geometries with optimized electromagnetic and thermal properties without the prohibitive tooling costs associated with traditional methods, making complex designs economically viable.
Solution Approach 2:
The patent applies local quality optimization by designing terminal structures with varying geometries in different regions - thicker sections for improved heat dissipation and electromagnetic behavior, and optimized connection areas for electrical performance. Additive manufacturing allows these local variations to be produced efficiently without increasing overall manufacturing complexity.
3Adaptability or versatility
If primary forming processes (casting, sintering, 3D printing) are used to create terminal structures, then production flexibility and design freedom are improved, but manufacturing precision and material density may decrease
Solution Approach 1:
The patent employs additive manufacturing technology which has advanced to provide both design flexibility and manufacturing precision. The process allows complex terminal geometries to be created with high precision while maintaining the advantages of primary forming processes, effectively bridging the gap between design freedom and structural accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal losses, enhances heat dissipation, and lowers production costs while enabling complex geometries for improved electromagnetic behavior and reduced weight, making it suitable for mobile applications.
Implementation Method 1
shaped by a primary forming process, such as casting, sintering or additive manufacturing
Implementation Method 2
shaped by a primary forming process, such as casting, sintering or additive manufacturing
Implementation Method 3
shaped by a primary forming process, such as casting, sintering or additive manufacturing
Implementation Method 4
increased surface area for convective cooling
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to a power semiconductor module (1) comprising a module housing (10), a substrate structure (20) with at least one metallization layer (22, 23) and at least one power semiconductor device (24) electrically connected to the at least one metallization layer (22, 23), which substrate structure (20) is attached to the module housing (10) to accommodate the power semiconductor device (24), and a terminal structure (40) electrically connected to the substrate structure (20) and configured for providing an external electrical interface (2, 4) of the power semiconductor module (1) for main power transmission and/or for control signal transmission of the substrate structure (20), wherein the terminal structure (40) has at least one electrical conductor (42, 44) shaped by a primary forming process.