Power Module Terminal Layout With Heatsink for Isolation and Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance power modules face limitations in maximum output current due to external power terminals, which can lead to overheating and potential electric isolation failures.
Innovation Solution
The power module design includes a substrate with semiconductor dies, an external power connection partially encapsulated with an exposed portion, and a heatsink mounted to the external power connection to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external power terminals are made narrower at the protrusion section, then the electric isolation is improved, but the temperature increases during operation
Solution Approach 1:
The invention transitions from a two-dimensional cross-sectional view to a three-dimensional solution by extending the external power terminals longitudinally with increased width at the protrusion section. This dimensional change allows the terminals to maintain narrow width at the encapsulation interface for electrical isolation while providing a wider heat dissipation surface further along the terminal length.
Solution Approach 2:
The external power terminals are designed with non-uniform cross-sections, having different widths at different locations. The terminals are narrow at the encapsulation interface for isolation but wider at the protrusion section for heat dissipation, creating local quality variations that simultaneously satisfy both electrical isolation and thermal management requirements.
2Reliability
If the external power terminals are kept protruding through the encapsulation material, then the electrical connection is maintained, but the encapsulation material is stressed and cracked
Solution Approach 1:
The invention changes the geometric parameters of the external power terminals by varying their width at different positions. The terminals have reduced width at the encapsulation interface, which minimizes the protrusion dimension and consequently reduces the stress and cracking risk to the encapsulation material while preserving electrical connectivity.
3Productivity
If the maximum output current is increased, then the power efficiency is improved, but the heat generation at external terminals increases
Solution Approach 1:
The invention performs preliminary heat dissipation by designing the external power terminals with increased width at the protrusion section before the heat reaches the encapsulation material. This preliminary action provides an extended heat dissipation path and larger surface area to dissipate heat generated by high output currents, preventing excessive temperature rise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for improved heat management, reducing peak temperatures and enabling higher performance operation of the power module while maintaining electrical isolation.
Implementation Method 1
a heatsink mounted to the first external power connection
Implementation Method 2
an encapsulant at least partially encapsulating the first external power connection
Data Source
AI summary
A power module includes a substrate, one or more semiconductor dies mounted to the substrate, a first external power connection electrically connected to a first power terminal of at least one of the one or more semiconductor dies, and an encapsulant at least partially encapsulating the first external power connection. A portion of the first external power connection and at least parts of an outer surface of the substrate are exposed from the encapsulant. A heatsink is mounted to the first external power connection.