Power Module Terminal Layout for Creepage and Loop Isolation
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Solution Overview
Problem
Existing power modules face challenges in achieving optimal creepage and clearance for high voltage safety while maintaining compact size and efficient power and signal loop independence, particularly in high power applications.
Innovation Solution
The power module design incorporates a substrate with parallel vertical power devices, a housing that encompasses these devices, and specific terminal configurations to ensure creepage and clearance, along with independent power and signal loops, using bond wires and lead frames for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power modules are designed with compact size for high power applications, then space efficiency is improved, but achieving optimal creepage and clearance for high voltage safety becomes difficult
Solution Approach 1:
The patent utilizes the vertical dimension by extending power terminals through the top surface of the housing rather than only through side surfaces. This three-dimensional terminal arrangement allows adequate creepage and clearance distances to be achieved within a compact footprint by utilizing space in multiple dimensions, thereby maintaining high voltage safety while reducing overall module size.
2Reliability
If power terminals extend through the top surface of the housing, then creepage and clearance are improved, but device complexity increases
Solution Approach 1:
The patent integrates multiple terminal functions into a unified housing structure. The housing serves both as a protective enclosure and as a mounting platform for terminals that extend through its top surface. This merging of structural and electrical functions reduces the need for separate terminal mounts or complex external wiring arrangements, thereby improving creepage and clearance without proportionally increasing overall device complexity.
3Power
If vertical power devices are used on the substrate, then power density is improved, but thermal management becomes more challenging
Solution Approach 1:
The patent extracts heat management functions from the substrate itself by providing a dedicated heat sink structure that is thermally coupled to the vertical power devices. This separation allows the substrate to focus on electrical functions while the dedicated heat sink handles thermal dissipation, enabling high power density through vertical devices without compromising thermal management capability.
Data Source
AI summary
A power module has a substrate having a top side with a first device pad and a second device pad. A first plurality of vertical power devices is coupled to the first device pad via first drain contacts, and a second plurality of vertical power devices is coupled to the second device pad via second drain contacts to form part of a power circuit. A housing encompasses portions of the substrate, the first plurality of vertical power devices, and the second plurality of vertical power devices. A first power terminal extends through a top surface of the housing to the first device pad. A second power terminal extends through the top surface of the housing to the source contacts on a top side of the second plurality of vertical power devices. A third power terminal extends through a top surface of the housing to the second device pad.