Power Semiconductor Module Assembly Using Terminal-Locked Housing

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Solution Overview

Problem

The assembly of power semiconductor modules is time-consuming and costly due to the need for additional pretreatment and hardening steps in gluing the housing to the substrate, which increases overall costs and process time.

Innovation Solution

A power semiconductor module arrangement with terminal elements that protrude vertically through the housing and include holding elements to secure the housing in place, eliminating the need for additional gluing steps by using the terminal elements to exert force and maintain the housing's position relative to the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the housing is glued to the substrate to remain in position, then the housing is securely held, but additional pretreatment steps, glue application, and hardening steps are required, increasing process time and cost

Engineering Contradiction:

Improvehousing position stabilityVSAvoidassembly process time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent extracts the housing fixation function from the gluing process and transfers it to the terminal elements. The terminal elements are inserted through the housing and bent at right angles to engage with the substrate, eliminating the need for glue and hardening steps while maintaining secure positioning.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical bonding mechanism (glue) with a mechanical fastening mechanism. The terminal elements are mechanically bent at right angles to engage with the substrate, providing secure fixation without requiring chemical adhesives or pretreatment steps.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If the housing is glued to the substrate, then the housing remains in desired position, but additional process steps (pretreatment, glue application, hardening) increase overall cost

Engineering Contradiction:

Improvehousing position stabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the housing fixation function from the gluing process and transfers it to the terminal elements. This eliminates the need for specialized pretreatment equipment, glue application systems, and hardening facilities, thereby reducing manufacturing complexity and cost.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical bonding system with a simple mechanical fastening system using bent terminal elements. This substitution eliminates multiple process steps and associated costs while maintaining secure housing fixation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If multiple additional steps (pretreatment, glue application, hardening) are added to secure the housing, then the housing is firmly attached, but the assembly process becomes more complex and time-consuming

Engineering Contradiction:

Improvehousing-substrate attachment strengthVSAvoidassembly process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent extracts the attachment function from the multi-step gluing process and consolidates it into the terminal element insertion and bending operation. This single integrated step provides firm attachment while dramatically simplifying the assembly process.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the complex chemical bonding process with a simple mechanical fastening operation. The terminal elements are inserted through the housing and bent at right angles to engage with the substrate, providing strong attachment through pure mechanical means without requiring multiple process steps.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution simplifies the assembly process by eliminating the need for additional gluing steps, reducing assembly time and costs while ensuring the housing remains securely positioned during shipping and installation.

Implementation Method 1

each of the plurality of holding elements exerts a force on the housing, thereby holding the housing in a desired position with regard to the substrate

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Data Source

PatentUS20240162099A1Power semiconductor module arrangement and method for assembling the same

Publication Date: 2024.05.16 INFINEON TECHNOLOGIES AG

AI summary

A power semiconductor module arrangement includes: a housing having a plurality of through holes; a substrate forming a ground surface of the housing; and a plurality of terminal elements mechanically and electrically connected to the substrate. A first end of each terminal element is arranged inside the housing and connected to the substrate. Each terminal element extends from the substrate in a vertical direction perpendicular to a top surface of the substrate through one of the through holes to the outside of the housing, such that a second end of each terminal element is arranged outside of the housing. Each terminal element includes a holding element arranged between the first end and the second end. Each holding element exerts a force on the housing, thereby holding the housing in a desired position with regard to the substrate.