Power Module Terminal Insert Molding Without Pin Blocks
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Solution Overview
Problem
Conventional methods for manufacturing power module terminals involve high costs due to multiple molding processes, are prone to dimensional errors, and can result in resin leaks and structural restrictions, especially when terminals are folded at right angles.
Innovation Solution
A method of integrating terminals with a substrate through insert molding without creating a pin block, allowing for seamless injection molding and improved accuracy by directly inserting terminals into the substrate, enabling flexible molding conditions and terminal positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If two molding processes (primary molding and secondary molding) are performed to manufacture the molded product, then the terminals can be collected together by the coupling portion, but the manufacturing cost increases and dimensional errors accumulate
Solution Approach 1:
The patent merges the primary molding and secondary molding processes into a single integrated molding process. The mold structure includes a first mold for forming the coupling portion and a second mold for forming the resin case, which are operated sequentially but constitute one unified manufacturing process. This eliminates the need to separately manufacture the coupling portion and then assemble it, thereby reducing both manufacturing complexity and dimensional error accumulation.
Solution Approach 2:
The molding process is segmented into two sequential stages within a single manufacturing operation: first forming the coupling portion with terminals in the first mold, then forming the resin case around it in the second mold. This segmentation allows each stage to be optimized independently while maintaining overall process integration, preventing dimensional errors from accumulating across separate manufacturing steps.
2Ease of manufacture
If terminals are folded at right angles and arranged with connection portions just below the terminals, then the coupling portion can be formed, but the connection mechanism becomes extremely restricted
Solution Approach 1:
The patent introduces a bending portion in the terminals that allows flexible positioning and adaptation. Instead of fixed right-angle folding, the bending portion can be configured at various angles and positions to accommodate different connection requirements. This dynamic configuration enables the connection mechanism to adapt to various main body substrate designs while maintaining ease of manufacturing.
3Ease of manufacture
If the coupling portion is manufactured separately and then injection molded, then the terminals can be collected, but seams are generated and liquid sealing material may leak through gaps
Solution Approach 1:
The patent combines the coupling portion formation and resin case molding into a single integrated process. The coupling portion is formed first in the first mold, then the second mold forms the resin case that completely encapsulates the coupling portion. This merging eliminates the seam that would exist between separately manufactured components, preventing liquid sealing material from leaking through gaps.
4Manufacturing precision
If integral molding is performed without making a pin block, then manufacturing cost decreases and accuracy improves, but terminals may fall down due to resin inflow during injection molding
Solution Approach 1:
The patent performs preliminary action by forming the coupling portion with terminals in the first mold before the resin case molding. This preliminary formation secures the terminals in their correct positions within the coupling portion, preventing them from falling down during the subsequent resin injection process. The coupling portion acts as a pre-formed structure that maintains terminal stability while enabling integrated molding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances accuracy, prevents resin leaks, and increases design freedom by eliminating pin block constraints, allowing for efficient terminal arrangement and downsizing of the power module.
Implementation Method 1
a step of arranging the substrate with the terminal in a mold (4) so that the second tip portion (13) is inserted into a terminal insertion portion (41) inside the mold (4), and a step of integrally molding the substrate (7) and the terminal (1) by flowing resin (5) into the mold (4)
Data Source
Figure 1(a)~1(c)
Figure 2
Figure 3(a)~3(b)
AI summary
There are provided a method of manufacturing a molded product for a power module capable of integrally molding terminals and a substrate, and a terminal in a particular shape used for the manufacturing method. The method ofmanufacturing the molded product for a power module includes the steps of: inserting a first tip portion of each of terminals having a particular shape into a substrate; arranging the substrate in a mold such that the second tip portion is inserted into a terminal insertion portion inside the mold; and integrally molding the substrate and the terminals by flowing resin into the mold.