Multi-Layer Power Module Layout for Flexible Terminal Reconfiguration
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Solution Overview
Problem
Conventional power modules require redesign and repositioning of components to change the chip and terminal connections, making them inflexible for design changes and expansions, which increases costs and complexity.
Innovation Solution
A power module design featuring multiple substrates with conductive patterns in a multi-layer structure, allowing for easy reconfiguration by connecting or disconnecting metal clips or wires without altering the entire substrate, and a spacer to maintain distance between substrates, enabling flexible design changes and expansions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the chip and terminal are directly connected through wire bonding in a conventional power module, then the electrical connection is simple, but any design change requires repositioning both the chip and terminal, making the module inflexible and increasing redesign complexity
Solution Approach 1:
The invention divides the power module into three separate substrates (first, second, and third substrates) that can be independently positioned and connected. The chip is mounted on the first substrate, while terminals are on the second substrate, with the third substrate providing additional connection flexibility. This segmentation allows individual substrates to be repositioned without requiring changes to other components, enabling design modifications without full module redesign.
Solution Approach 2:
The invention transitions from a conventional two-substrate configuration to a three-substrate stacked architecture, adding a dimensional layer to the module structure. This additional substrate layer provides extra degrees of freedom for routing electrical connections and positioning components, allowing design changes to be accommodated by reconfiguring connections on the third substrate rather than repositioning the chip or terminals themselves.
2Adaptability or versatility
If multiple substrates are used to enable design changes, then flexibility is improved, but the manufacturing process and assembly become more complex
Solution Approach 1:
The invention pre-mounts the chip on the first substrate and pre-positions the terminals on the second substrate during separate preparation stages. The third substrate is designed with predetermined connection patterns that can be flexibly assigned to connect the chip to various terminals. This preliminary arrangement of components simplifies the final assembly process, as the substrates can be stacked and connected in a standardized sequence without requiring complex real-time positioning during assembly.
3Ease of operation
If the chip is electrically connected to distant terminals through wire bonding, then connection flexibility is limited, but redesigning the entire module is required for any connection change
Solution Approach 1:
The invention segments the electrical connection path across three separate substrates, with the third substrate acting as an intermediate connection layer. This allows the chip on the first substrate to be connected to multiple different terminal configurations on the second substrate by simply changing the connection pattern on the third substrate, without requiring changes to the chip or terminal positions. Wire bonding or other connection methods can be applied to the third substrate to establish flexible electrical paths between the fixed chip and variable terminal assignments.
Data Source
AI summary
Disclosed are a power module and a method for manufacturing the same. A power module according to an embodiment of the present disclosure includes: a first substrate; a second substrate disposed spaced apart from the first substrate and including at least one metal layer; at least one chip disposed between the first substrate and the second substrate and in electrical contact with the metal layer; and a third substrate configured to be disposed spaced apart from the first substrate and the second substrate, electrically connect the chip and at least one external input terminal, include one or more conductive patterns each of which is connected to one of the at least one lead frame, and be formed in a multi-layer structure such that the one or more conductive patterns are not short-circuited to each other.