Power Module Electrode Terminal Retrofitting for Flexible Positioning

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Solution Overview

Problem

Existing semiconductor devices require significant changes in manufacturing processes and costs when altering electrode positions due to fixed electrode positions in the mold, necessitating changes in metal mold and frame shapes.

Innovation Solution

The electrode terminals are separated from the electrodes and retrofitted with high precision using projections and projections in the mold resin to facilitate easy adjustment of electrode positions, allowing for precise mounting and bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If electrode positions are fixed in the mold, then manufacturing process is simplified, but adaptability to change electrode positions deteriorates

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidelectrode position changeability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The electrode terminal is divided into a body portion and a protruding portion, where the body portion is bonded to the electrode and the protruding portion extends outward. This segmentation allows the electrode terminal to be separated from the mold structure, enabling position changes without requiring mold modifications.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The electrode terminal is extracted from the integrated mold structure and made as a separate component that can be bonded to the electrode. This extraction allows the electrode position to be changed by removing and repositioning the terminal without altering the mold itself.

Inventive Principle:
Principle #2Taking out (Extraction)

2Ease of operation

If electrode terminals are integrated with the mold, then positioning is simplified, but ease of modification deteriorates

Engineering Contradiction:
Improvepositioning simplicityVSAvoidmodification ease
Core Design Contradiction:
Ease of operationVSEase of repair

Solution Approach 1:

Protrusions are provided on the body portion of the electrode terminal and corresponding recesses are formed in the electrode before bonding. This preliminary action of creating complementary fitting structures ensures precise positioning during the bonding process, while the separate component design maintains ease of modification.

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If electrode position is changed, then adaptability improves, but manufacturing cost increases

Engineering Contradiction:
Improveelectrode position flexibilityVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The electrode terminal is designed as a dynamic component that can be repositioned and rebonded to different electrode locations. This dynamic capability allows position changes without requiring expensive mold modifications, maintaining manufacturing cost efficiency while improving adaptability.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12538811B2Semiconductor device comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, semiconductor device group comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin, and power conversion apparatus comprising an electrode terminal and an electrode exposed in an opening provided in a mold resin
Publication Date: 2026.01.27 MITSUBISHI ELECTRIC CORP
  • US12538811B2 patent drawing
  • US12538811B2 patent drawing
  • US12538811B2 patent drawing

AI summary

Even if there is a change in the shape of a transfer mold power module is required, a change in a position of the electrode of the module is facilitated by separating electrode terminals of a power module from the electrodes and retrofitting the separated electrode terminals to the electrodes with high precision. A semiconductor device includes a mold resin enclosing a semiconductor chip, an electrode electrically connected to the semiconductor chip and exposed in an opening provided in the mold resin, and an electrode terminal having a contact portion that covers the electrode and is in electrical contact with the electrode, a plurality of projections formed to surround the contact portion and provided between a side surface of the opening and the contact portion, a contact end portion having the contact portion and an open end portion which is a different end portion from the contact end portion.