Power Module Electrode Terminal Retrofitting for Flexible Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices require significant changes in manufacturing processes and costs when altering electrode positions due to fixed electrode positions in the mold, necessitating changes in metal mold and frame shapes.
Innovation Solution
The electrode terminals are separated from the electrodes and retrofitted with high precision using projections and projections in the mold resin to facilitate easy adjustment of electrode positions, allowing for precise mounting and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electrode positions are fixed in the mold, then manufacturing process is simplified, but adaptability to change electrode positions deteriorates
Solution Approach 1:
The electrode terminal is divided into a body portion and a protruding portion, where the body portion is bonded to the electrode and the protruding portion extends outward. This segmentation allows the electrode terminal to be separated from the mold structure, enabling position changes without requiring mold modifications.
Solution Approach 2:
The electrode terminal is extracted from the integrated mold structure and made as a separate component that can be bonded to the electrode. This extraction allows the electrode position to be changed by removing and repositioning the terminal without altering the mold itself.
2Ease of operation
If electrode terminals are integrated with the mold, then positioning is simplified, but ease of modification deteriorates
Solution Approach 1:
Protrusions are provided on the body portion of the electrode terminal and corresponding recesses are formed in the electrode before bonding. This preliminary action of creating complementary fitting structures ensures precise positioning during the bonding process, while the separate component design maintains ease of modification.
3Adaptability or versatility
If electrode position is changed, then adaptability improves, but manufacturing cost increases
Solution Approach 1:
The electrode terminal is designed as a dynamic component that can be repositioned and rebonded to different electrode locations. This dynamic capability allows position changes without requiring expensive mold modifications, maintaining manufacturing cost efficiency while improving adaptability.
Data Source
AI summary
Even if there is a change in the shape of a transfer mold power module is required, a change in a position of the electrode of the module is facilitated by separating electrode terminals of a power module from the electrodes and retrofitting the separated electrode terminals to the electrodes with high precision. A semiconductor device includes a mold resin enclosing a semiconductor chip, an electrode electrically connected to the semiconductor chip and exposed in an opening provided in the mold resin, and an electrode terminal having a contact portion that covers the electrode and is in electrical contact with the electrode, a plurality of projections formed to surround the contact portion and provided between a side surface of the opening and the contact portion, a contact end portion having the contact portion and an open end portion which is a different end portion from the contact end portion.


