Power Module Control Terminal Stress Isolation
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Solution Overview
Problem
Existing power modules face increased production costs due to integral control terminal formation and suffer from reduced dielectric strength and reliability due to stress transfer to the insulating substrate during connector attachment, leading to potential substrate fracture or displacement.
Innovation Solution
A semiconductor device design featuring a control terminal with a protrusion portion and a processed portion that are independently formed and assembled, using a protrusion receiving portion and convex portion in the resin case to prevent stress transfer to the insulating substrate, ensuring the control terminal remains fixed and preventing substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the control terminal is integrally formed with the control terminal block and fitted into the resin case, then the production cost increases, but the control terminal can be securely fixed
Solution Approach 1:
The control terminal is divided into multiple segments: a connection portion attached to the insulating substrate, a processed portion with a bent shape, and a penetration portion that penetrates the resin case. This segmentation allows each part to perform its specific function independently, securing the control terminal without requiring integral formation with the control terminal block, thereby reducing production cost while maintaining fixing security.
2Ease of manufacture
If the control terminal is directly attached to the insulating substrate, then the attachment process is simplified, but stress is transferred to the insulating substrate during connector attachment causing substrate fracture or displacement
Solution Approach 1:
The resin case serves as an intermediary between the control terminal and the insulating substrate. The penetration portion of the control terminal penetrates the resin case, and the processed portion with its bent shape absorbs stress during connector attachment. This intermediary structure prevents direct stress transfer to the insulating substrate, maintaining substrate integrity while allowing a relatively simple attachment process.
3Ease of operation
If the control terminal has a long free length to reach from the insulating substrate to the outer side, then the connector can be easily connected, but the control terminal becomes more susceptible to stress during attachment and detachment
Solution Approach 1:
The processed portion of the control terminal is designed with a bent shape that provides dynamic stress absorption. When stress is applied during connector attachment and detachment, the bent portion can deform elastically to absorb the stress, then return to its original shape. This dynamic characteristic allows the control terminal to maintain a sufficient free length for easy connector connection while resisting stress through elastic deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances dielectric strength and reliability by preventing stress transfer to the insulating substrate during connector attachment and detachment, reducing the risk of substrate fracture and solder damage.
Implementation Method 1
The control terminal 6 has a processed portion 6b which is connected to an end of the penetration portion 6a and has a bent shape. The control terminal 6 functions as a spring due to elasticity of the processed portion 6b to press down the insulating substrate 2
Data Source
Figure 1(a)~1(d)
Figure 2
Figure 3(a)~3(c)
AI summary
Provided is a power module (100) including a metal base (1), an insulating substrate (2) which is attached to the metal base (1), a semiconductor chip and a control terminal (6) which are attached to a circuit pattern of the insulating substrate (2), and a resin case (7) which is attached to the metal base (1). The control terminal (6) includes a penetration portion (6a) which penetrates a cover (9) of the resin case (7), an L-shaped processed portion (6b) which is connected to the penetration portion (6a), and a connection portion (6c) which is connected to the L-shaped processed portion (6b). A protrusion portion (10) is installed in a portion of the control terminal (6), which penetrates the cover (9). The protrusion portion (10) is in contact with a protrusion receiving portion (9b) which is configured with a front surface of the cover (9). The L-shaped processed portion (6b) is in contact with a convex portion (9c) which is installed in a rear surface of the cover (9). Accordingly, at the time of detaching a connector from the control terminal (6), a stress is prevented from being transferred to the insulating substrate (2), so that it is possible to provide a semiconductor device having high dielectric strength and high reliability.