Pre-Bent Semiconductor Power Module Substrate for Thermal Contact
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Solution Overview
Problem
Conventional insulated metal substrates face challenges in efficient heat dissipation and reliability, especially for high voltage and large-sized power module applications, due to thermal mismatch and concave bow formation which reduces thermal performance.
Innovation Solution
A semiconductor power module with a pre-bent insulated metal substrate structure, featuring a metal top and bottom layer with a dielectric layer in between, and a housing with terminals that apply compressive load to create a convex shape, ensuring proper thermal interface and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional flat insulated metal substrates are used, then manufacturing is simple, but thermal contact with heat sink is poor due to concave bow formation
Solution Approach 1:
The insulated metal substrate is pre-bent to have a convex shape on its backside before assembly. This preliminary action compensates for the concave bow that would naturally form during operation, ensuring proper thermal contact with the heat sink from the outset.
Solution Approach 2:
The convex pre-bending applies a counter-action to the expected concave bow deformation. By pre-shaping the substrate with opposite curvature, the design prevents the formation of thermal gaps between the substrate and heat sink during operation.
2Power
If the insulated metal substrate is made larger for high power applications, then power handling increases, but thermal performance deteriorates due to increased bowing
Solution Approach 1:
Larger insulated metal substrates are pre-bent with a convex shape to compensate for the increased concave bowing that occurs with larger dimensions. This allows high power handling capability while maintaining thermal contact quality despite the scale-induced deformation.
3Strength
If the substrate is rigid to maintain structural stability, then mechanical strength increases, but thermal contact decreases due to inability to conform to heat sink surface
Solution Approach 1:
The substrate is given a controlled convex curvature on its backside rather than being completely flat or completely flexible. This moderate curvature allows the substrate to maintain structural integrity while enabling better conformal contact with the heat sink surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation and reliable functioning for high voltage power modules by preventing cavity formation and maintaining a flat thermal interface with the heat sink, enhancing thermal contact and module reliability.
Implementation Method 1
The housing and the at least one terminal expose compressive load on the top side or upper surface of the metal substrate structure
Implementation Method 2
the metal substrate structure is bent in a predetermined manner and comprises a convex shape of its backside
Implementation Method 3
enables efficient heat dissipation and reliable functioning even for high voltage power module applications
Implementation Method 4
the convex bow of a backside thus formed contributes to a proper thermal contact between the metal substrate structure and a cooler
Data Source
AI summary
A semiconductor power module comprises a metal substrate structure with a metal top layer, a metal bottom layer, and a dielectric layer in between. A housing with a top wall and side walls is coupled to the metal substrate structure. With respect to a stacking direction, there is a predetermined distance between a lower surface of the top wall and an upper surface of the metal top layer adjacent to the side walls. At least one terminal is arranged inside the housing, and is coupled to the lower surface of the top wall and to the upper surface of the metal top layer. With respect to the stacking direction, a length of the terminal is configured in coordination with the distance, such that due to the terminal, the metal substrate structure is bent in a predetermined manner and comprises a convex shape in interaction with the housing and the terminal.