Intelligent Power Module Assembly for Compact Thermal Isolation
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Solution Overview
Problem
Existing intelligent power modules for vehicles face challenges in achieving effective heat radiation and miniaturization while ensuring safety and high performance, particularly in electric and hybrid vehicles, where high functionality and reliability are critical.
Innovation Solution
The intelligent power module incorporates a heat radiation device with an attachment frame, power semiconductor modules, and a drive circuit part mounted via a heat insulating sheet, enabling efficient heat dissipation and modularization, and is suitable for miniaturization and automated assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooler with coolant is used to enhance heat radiation, then heat dissipation performance is improved, but device complexity and size increase
Solution Approach 1:
The invention extracts the coolant circulation system from the power module assembly by using a heat sink with integrated cooling channels that require no coolant supply lines or pumps, thereby simplifying the overall system while maintaining effective heat dissipation
Solution Approach 2:
The heat sink is designed with self-cooling capabilities through its internal heat dissipation structure that passively manages thermal energy without requiring external cooling systems, making the module self-sufficient for thermal management
2Volume of moving object
If multiple power semiconductor modules are integrated into one package, then miniaturization is achieved, but heat radiation becomes more difficult
Solution Approach 1:
The heat sink is divided into multiple independent heat dissipation regions, each corresponding to a power semiconductor module, allowing each module to have dedicated thermal management pathways that maintain effective heat radiation despite high integration density
Solution Approach 2:
The invention transitions from planar heat dissipation to three-dimensional heat sink structures with vertical cooling channels and extended surface areas, enabling efficient heat radiation from multiple modules stacked in compact configuration
3Manufacturing precision
If manual assembly methods are used for power modules, then assembly precision is maintained, but productivity is low
Solution Approach 1:
The attachment frame and heat sink are pre-assembled with precisely positioned mounting holes and alignment features before power semiconductor modules are installed, enabling automated pick-and-place machinery to accurately position components without manual intervention while maintaining high precision
Solution Approach 2:
The attachment frame serves multiple functions including mechanical support, electrical connection, and thermal management interface, allowing a single standardized component to work across different module configurations and enabling automated assembly lines to handle various module types
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat radiation characteristics, improves reliability, and facilitates mass production, resulting in a highly efficient and safe power module for electric and hybrid vehicles.
Implementation Method 1
a drive circuit part mounted on the power semiconductor module via a heat insulating sheet
Implementation Method 2
a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device
Data Source
AI summary
An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.