Power Module PCB Thickness Zoning for Automated Solder Filling
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Solution Overview
Problem
Conventional power modules face issues with reduced solder filing efficiency, increased manufacturing time, and higher risk of electronic component short-circuiting due to increased circuit board thickness and reduced flash distance, necessitating manual soldering and lower yield.
Innovation Solution
A power module design with a circuit board featuring grooves and varying thickness regions, utilizing local heating welding to penetrate pins through thinner through holes and fill solder efficiently, allowing automated soldering and reducing short-circuit risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the thickness of the circuit board is increased to enhance output power, then the power output is improved, but the solder filling efficiency is reduced and manufacturing time is increased
Solution Approach 1:
The circuit board is segmented into different thickness regions: a first region with greater thickness for power enhancement and a second region with lesser thickness for efficient solder filling. This segmentation allows the board to simultaneously achieve high power output and maintain good solder filling efficiency in critical areas.
Solution Approach 2:
Different regions of the circuit board are assigned different thickness qualities according to their functional requirements. The first region has increased thickness where power handling is critical, while the second region has reduced thickness where solder filling efficiency is prioritized, optimizing overall performance.
2Power
If the thickness of the circuit board is increased, then the power output is improved, but the manufacturing time is increased due to reduced solder filling efficiency
Solution Approach 1:
The circuit board is divided into thickness zones that optimize the balance between power capability and manufacturing efficiency, reducing the time required for solder filling while maintaining adequate power output capacity.
Solution Approach 2:
By providing different thickness characteristics in different regions, the circuit board enables faster solder filling in the second region without compromising the power handling capability of the first region, thereby reducing overall manufacturing time.
3Volume of moving object
If the flash distance between electronic components is reduced to achieve miniaturization, then the power module size is reduced, but the risk of short-circuiting is increased
Solution Approach 1:
The circuit board provides different thickness qualities in different regions to optimize both miniaturization and reliability. The varied thickness profile allows for reduced flash distance while maintaining adequate solder filling and electrical isolation, thereby reducing short-circuit risk despite compact component spacing.
4Reliability
If manual soldering is used to avoid short-circuits, then the reliability is improved, but the productivity is reduced
Solution Approach 1:
The circuit board's varied thickness profile enables automated soldering equipment to achieve reliable connections without manual intervention. The second region with lesser thickness facilitates proper solder filling and component spacing, allowing automated processes to maintain both high productivity and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances soldering efficiency, reduces manufacturing time, and increases product yield by improving solder filling and preventing electronic component short-circuits, enabling automated soldering processes.
Implementation Method 1
the solder is partially heated so as to fix the at least one pin on the second electronic assembly and electrically connect with the at least one soldering pad
Data Source
AI summary
A power module and a manufacturing method are provided. The power module includes a first electronic assembly and a second electronic assembly. The first electronic assembly includes at least one pin. The second electronic assembly includes a first surface and a second surface opposite to each other. The first surface is more adjacent to the first electronic assembly than the second surface. A direction from the first surface toward the second surface is defined as a reference direction. The second electronic assembly includes a first region and a second region. The first region has a first thickness in the reference direction. The second region has a second thickness in the reference direction. The second thickness is less than the first thickness. The second region includes at least one through hole. The pin is penetrated through the at least one through hole and fixed on the second electronic assembly.