Power Module Metal Structure for Vertical Signal Conduction
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Solution Overview
Problem
Conventional power modules with nail frames for signal conduction increase module size and complexity, requiring careful consideration of pin orientation and size, which complicates circuit design and manufacturing.
Innovation Solution
A power module structure featuring a substrate with exposed first and second metal structures for vertical signal conduction, where the metal structures are made of high thermal and electrical conductivity materials like copper, silver, or aluminum, and are adjustable in dimension, quantity, position, and shape to optimize bonding and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a nail frame is used for signal conduction, then the module can conduct current and signals, but the overall size of the power module increases and the circuit design becomes more complicated
Solution Approach 1:
The patent extracts the nail frame component from the power module structure, replacing it with metal patterns directly formed on the substrate. This elimination of the separate nail frame component reduces the overall module size while maintaining the essential signal conduction function through the integrated metal patterns.
Solution Approach 2:
The patent merges the signal conduction function previously performed by the separate nail frame into the substrate itself by forming metal patterns directly on the substrate. This integration combines the substrate and conduction path into a single unified structure, eliminating the need for additional components and reducing overall module size.
2Reliability
If a nail frame is used for signal conduction, then the module can conduct current and signals, but the circuit design becomes more complicated with considerations for pin orientation and size
Solution Approach 1:
The patent merges the signal conduction function previously performed by the separate nail frame into the substrate itself by forming metal patterns directly on the substrate. This integration combines the substrate and conduction path into a single unified structure, eliminating the need for additional components and reducing overall module size.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides mechanical support, electrical insulation, and signal conduction through its integrated metal patterns. This multi-functionality eliminates the need for separate nail frame components and simplifies the overall circuit design by reducing the number of elements that need to be considered.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for rapid and efficient signal conduction while minimizing circuit length, enabling large current transmission and simplifying the manufacturing process by allowing adjustments based on product requirements, such as increased bonding force through specific metal structure designs like I-shapes or through-holes.
Implementation Method 1
the first metal structure and the second metal structure for signal conduction are disposed on the substrate and exposed from the upper surface of the packaging material to conduct signals from the substrate to the surface of the packaging material
Implementation Method 2
Since the first metal structure is a solid structure, large current transmission can be achieved
Implementation Method 3
designing the first metal structure into an I-shape can increase the bonding area and bonding force between the first metal structure and the packaging material
Implementation Method 4
designing the first metal structure to include a through-hole structure can increase the bonding force between the first metal structure and the packaging material
Data Source
AI summary
A power module structure is provided. The power module structure includes a substrate, a chip, a first metal structure, a second metal structure and a packaging material. The chip, the first metal structure and the second metal structure are disposed on the substrate. From a cross-sectional view, the width of the first metal structure is greater than the width of the second metal structure. The packaging material covers the substrate and the chip, and the portions of the first metal structure and the second metal structure are exposed from the upper surface of the packaging material.