Three-Layer Power Module With Vertical PCB Connections
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Solution Overview
Problem
Power modules used in hybrid and electric vehicles face challenges in achieving high strength, high heat dissipation, and minimizing current paths to improve efficiency and performance, while also reducing volume and stress concentration.
Innovation Solution
A three-layer structure power module is designed with a lower ceramic substrate, an upper ceramic substrate, and a PCB substrate, featuring through holes and connection pins for perpendicular electrical connections, laser welding, and a curvature inclined part at the edge of the ceramic substrate to enhance bonding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a power module uses high voltage and high current to drive motors in hybrid and electric vehicles, then the power output and driving capability are improved, but heat generation increases due to high voltage and vibration during driving
Solution Approach 1:
The power module employs a double-sided cooling structure with separate heat sinks provided on both the upper and lower sides of the ceramic substrates. This segmentation of cooling functions allows heat to be dissipated from both surfaces of the semiconductor chip, effectively managing heat generation while maintaining high power output capability
Solution Approach 2:
Ceramic substrates are used as intermediary components between the semiconductor chip and the heat sinks. These substrates provide both electrical insulation and thermal conduction pathways, enabling efficient heat transfer from the high-power semiconductor devices to the cooling structures while maintaining electrical isolation
2Device complexity
If a power module uses a cross-section cooling structure with a heat sink on one side, then the structure is simpler, but the cooling performance is insufficient compared to double-sided cooling
Solution Approach 1:
The cooling system is segmented into two independent cooling paths - one heat sink on the upper side and another on the lower side. This allows heat to be removed from both surfaces of the semiconductor chip simultaneously, doubling the effective cooling area and significantly improving heat dissipation capability compared to single-sided cooling
Solution Approach 2:
The cooling approach transitions from one-dimensional (single-sided) heat dissipation to two-dimensional (double-sided) heat dissipation. By providing heat sinks on both the upper and lower surfaces of the ceramic substrates, the module utilizes both vertical dimensions for heat removal, effectively doubling the thermal management capacity
3Volume of stationary object
If the electrical connection distance between the upper ceramic substrate and the PCB substrate is long, then the module volume is larger, but the current path is longer which reduces efficiency and performance
Solution Approach 1:
Instead of using traditional lateral or angled connection methods, the patent employs perpendicular through-hole connections where connection pins pass directly through the upper ceramic substrate to establish electrical contact with the PCB substrate. This inverted connection approach minimizes the current path length by creating a direct vertical pathway, reducing inductance and improving high-frequency performance while maintaining compact dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high strength, efficient heat dissipation, reduced volume, improved performance, and extended lifespan by minimizing current paths and stress concentrations, thereby enhancing the reliability and efficiency of high-speed current handling.
Implementation Method 1
The connection pin formed in the through hole in a way to penetrate through the through holes is bonded to an electrode pattern at an edge of the through hole by laser welding
Data Source
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AI summary
The present invention relates to a power module comprising: a lower ceramic substrate (200); an upper ceramic substrate (300) which is disposed above the lower ceramic substrate (200) and has a semiconductor chip (G) mounted on the lower surface thereof; a PCB substrate (400) disposed above the upper ceramic substrate (300); and a connection pin (800) which extends through through holes (320 and 420) formed in the upper ceramic substrate (300) and the PCB substrate (400), and vertically connects electrode patterns (a, b, c, and d) formed on the upper ceramic substrate (300) and the PCB substrate (400). The present invention provides a shortened electrical connection distance between the upper ceramic substrate and the PCB substrate, and thus can minimize a current path and enhance the moving efficiency of a high-speed current.