Integrated Power Module Vias for Low-Inductance Inverter Cooling
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Solution Overview
Problem
Traditional inverters have a large volume profile due to separated power devices, gate drivers, and capacitors, leading to high power loss and poor thermal management, especially at high switching frequencies, which limits their power density and size efficiency in applications like vehicles.
Innovation Solution
An integrated inverter design where power devices are coupled to a substrate with upper and lower cooling assemblies that include vias to electrically connect gate drivers and capacitors, reducing parasitic inductance and improving thermal management through hybrid two-phase cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If power devices are connected to driver board through pin connections extending distance, then electrical connection is established, but volume profile increases and system loop inductance increases resulting in high power loss
Solution Approach 1:
The patent merges the driver board and power devices into a single integrated module, eliminating separate pin connections. The driver circuitry is fabricated directly on the same substrate as the power devices, reducing connection distance to minimal trace lengths and dramatically lowering loop inductance and power loss.
Solution Approach 2:
The patent transitions from traditional planar pin connections to a three-dimensional integrated structure where driver and power devices coexist on the same substrate. This vertical integration approach reduces the horizontal distance between components, minimizing loop area and associated inductance.
2Temperature
If traditional separate cooling units are used to regulate temperature, then thermal management is provided, but volume profile increases and power density decreases
Solution Approach 1:
The patent integrates the cooling assembly directly with the power module substrate, forming a unified thermal management structure. The cooling channels are embedded within or attached to the same substrate that carries the power devices, eliminating separate cooling units and reducing overall volume.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for power devices, electrical connections through traces, and thermal management through integrated cooling channels. This multi-functionality eliminates the need for separate structural and thermal management components.
3Productivity
If power devices are switched on and off at high frequency, then power control performance is improved, but heat generation increases requiring additional cooling
Solution Approach 1:
The patent extracts heat removal as a primary function and integrates it directly into the power module structure. By embedding cooling channels in immediate thermal contact with power devices, heat is extracted at the source before it can propagate, enabling high-frequency switching without excessive temperature rise.
Solution Approach 2:
The integrated cooling assembly acts as an intermediary between the power devices and the external cooling fluid. This intermediate thermal management structure provides efficient heat transfer path, allowing high-power switching operations by mediating the thermal load.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated inverter design reduces size, minimizes power loss, and enhances thermal management, allowing for compact and efficient power control systems with reduced inductance, suitable for vehicle applications.
Implementation Method 1
an upper cooling assembly thermally coupled to an upper side of the substrate and a lower cooling assembly thermally coupled to a lower side of the substrate
Implementation Method 2
improving thermal management through hybrid two-phase cooling
Data Source
AI summary
A system includes a power device unit coupled to a substrate. An upper cooling assembly is thermally coupled to an upper side of the substrate. A lower cooling assembly is thermally coupled to a lower side of the substrate. A gate driver unit is coupled to the upper cooling assembly. At least one upper via is formed through the upper cooling electrically coupling the gate driver unit to the power device unit. A capacitor unit is coupled to the lower cooling assembly. At least one lower via formed through the lower cooling assembly electrically coupling the capacitor unit to the power device unit.