Liquid-Cooled Power Module With Wedge-Shaped Duct
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Solution Overview
Problem
Existing power electronics devices face challenges in achieving even cooling liquid flow and reducing temperature around power components, particularly when components are connected in parallel, leading to inefficiencies and increased costs due to the need for additional components and fans for cooling.
Innovation Solution
A power unit design with symmetrically fixed power modules on opposite outer sides of a frame, featuring a wedge-shaped liquid duct and protrusions on the cooling surface to ensure turbulent flow and direct heat transfer, eliminating the need for separate fixing parts and internal fans by using a common substrate for mechanical support and cooling liquid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power components are connected in parallel to handle high power, then power handling capability is improved, but flow evenness between components deteriorates
Solution Approach 1:
The liquid duct is designed with asymmetric cross-sectional areas to compensate for flow distribution issues. Specifically, the duct cross-sectional area is made larger on the side with higher flow resistance and smaller on the side with lower flow resistance, thereby achieving even flow distribution to parallel-connected power components without requiring additional balancing components
Solution Approach 2:
The duct cross-sectional area is locally adjusted along its length to optimize flow distribution. By varying the cross-sectional area at different locations, the design compensates for differences in flow resistance to parallel components, ensuring even cooling liquid flow without affecting the overall power handling capability
2Temperature
If cooling liquid flow is increased to improve cooling effectiveness, then cooling performance is improved, but turbulence difficulty increases
Solution Approach 1:
Protrusions are added to the cooling surface to disrupt laminar flow and promote turbulence. These surface irregularities create flow separation and mixing, enhancing heat transfer efficiency without requiring complex internal duct geometries or additional turbulence-generating components
3Productivity
If circuit boards are disposed close to power components for electrotechnical reasons, then electrical connection efficiency is improved, but temperature control deteriorates
Solution Approach 1:
The device is segmented into thermally isolated zones. Power components are cooled by direct liquid contact, while circuit boards are positioned in separate air-cooled compartments. This spatial segmentation allows electrical proximity for efficiency while maintaining thermal independence to protect sensitive electronics from high temperatures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures even cooling liquid flow and reduced temperature around power components, minimizing the need for fans and lowering manufacturing costs and thermal resistance, while maintaining the flexibility of parallel or different task functionality for power modules.
Implementation Method 1
by transferring the dissipation power produced in the components via liquid circulating in the device to outside the device
Implementation Method 2
transferring the dissipation power produced in the components via liquid circulating in the device
Implementation Method 3
turbulence that enhances cooling are difficult to achieve
Data Source
Figure 1~3
Figure 4~5B
AI summary
Liquid-cooled power unit of a power electronics device, which power unit comprises at least two power modules (200), the cooling surface of which power modules is provided with pin-type protrusions (205) and which power modules (200) are fixed to the frame part (402) of the power unit. A liquid duct (403) is arranged inside the frame part (402) of the power unit, and the power modules (200) are fixed to the points of the apertures situated in the frame part on both sides of the liquid duct (403) in such a way that the pin-type protrusions (205) of the power modules (200) are situated in the liquid duct (205). A wedge-shaped part (404) is disposed in the liquid duct, which wedge-shaped part comprises a wedge-shaped front part (409) for spreading the liquid flow (405) into two essentially equal flows at the point of the power modules (200).