Power Module Wire Pad Layout for Molding-Resistant Control Bonds
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Solution Overview
Problem
Lead frame-type transfer-molded power modules face insulation failure due to deformation of wire bonds during molding resin infusion, causing them to contact the lead frame.
Innovation Solution
The semiconductor device incorporates a configuration where the control chips are mounted on a lead frame die pad, with wire pads arranged close to the control chips to shorten first control wires, thereby reducing deformation and insulation failure risks during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonds are used to connect control chip and power chip, then electrical connection is achieved, but wire bonds deform during molding resin infusion causing insulation failure
Solution Approach 1:
The patent applies preliminary action by pre-positioning the wire bonds in optimized locations and orientations before the molding process. The control wires are routed through dedicated channels and secured at strategic points to prevent deformation during resin infusion, thereby maintaining insulation reliability while accommodating the molding process.
Solution Approach 2:
The patent introduces intermediary structures such as support frames, channel walls, and positioning elements that act as mediators between the wire bonds and the molding resin. These intermediaries protect the wire bonds from direct contact with the flowing resin and prevent deformation, thus maintaining both wire bond stability and insulation reliability.
2Adaptability or versatility
If wire bonds are extended to reach distant connection points, then electrical connection coverage is improved, but wire bonds become more prone to deformation and insulation failure
Solution Approach 1:
The patent applies segmentation by dividing the wiring system into multiple segments or zones. Instead of using single long wire bonds, the connection paths are broken into shorter segments with intermediate connection points or support structures. This reduces the span of each wire bond, minimizing deformation risk while maintaining comprehensive connection coverage across the module.
Solution Approach 2:
The patent utilizes another dimension by routing wire bonds through three-dimensional channels and layers rather than simple planar paths. Wire bonds are directed through vertical channels, lateral passages, and multi-level routing structures, allowing connection coverage to be achieved with shorter, more protected bond paths that are less susceptible to deformation.
Data Source
AI summary
A semiconductor device includes: at least one control chip provided at a position overlapping a first die pad in plan view and electrically connected to the first die pad; a plurality of power chips mounted to respective second die pads; a plurality of circuit patterns and a plurality of wire pads arranged on a top surface of an insulating substrate provided on a top surface of the first die pad; a plurality of first control wires electrically connecting the plurality of wire pads and the at least one control chip; and a plurality of second control wires electrically connecting the at least one control chip and the plurality of power chips.