Interconnected Power Modules in Rotating Electric Machine Architecture

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Solution Overview

Problem

Existing rotating electrical machines with synchronous rectification require complex and costly architectures for power electronic modules, which include a heat-conducting sole that is not optimized for heat dissipation, increasing mechanical parts and complexity.

Innovation Solution

The power electronic modules are directly integrated into a heat sink with open cavities, using DBC technology substrates for MOSFET transistors and ASIC control circuits, and connected via insulating plates with conductive traces, allowing for improved thermal conductivity and reduced mechanical complexity through direct gluing and filling with gel for insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If power modules use a heat-conducting sole with insulating pad arrangement, then electrical insulation is provided, but heat dissipation efficiency deteriorates and mechanical complexity increases

Engineering Contradiction:
Improveelectrical insulationVSAvoidheat dissipation efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent introduces a metallic plate with high thermal conductivity as an intermediary component between the power modules and the heat sink. This plate serves as a thermal mediator that efficiently conducts heat away from the modules while the insulating pad maintains electrical isolation, thus resolving the contradiction between heat dissipation and electrical insulation requirements

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent merges the heat-conducting sole and insulating pad into an integrated arrangement where the metallic plate is positioned in direct thermal contact with the power modules, combining thermal management and electrical insulation functions into a unified structure that reduces mechanical complexity while improving heat dissipation

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If power modules are packaged in mechatronic boxes with leadframes, then electrical connections are established, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improveelectrical connection establishmentVSAvoidmechanical parts quantity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts the power modules from traditional mechatronic box packaging and directly mounts them onto the metallic plate/heat sink structure. This eliminates unnecessary intermediate packaging components while maintaining electrical connection functionality through the metallic plate and connection elements, thereby reducing device complexity and manufacturing cost

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If heat flow passes through insulating pad and heat-conducting sole, then electrical insulation is maintained, but thermal conduction path is not optimized

Engineering Contradiction:
Improveelectrical insulationVSAvoidthermal conduction efficiency
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent applies local quality by creating distinct functional zones: the metallic plate provides high thermal conductivity in thermal contact areas with power modules, while insulating pads are strategically positioned only where electrical insulation is required. This localized differentiation optimizes thermal conduction paths without compromising electrical insulation where needed

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation efficiency, reduces mechanical complexity and cost, while maintaining the performance advantages of existing technologies by integrating power and control circuits directly onto a heat sink with optimized thermal management.

Implementation Method 1

The wafer has good thermal conduction properties so as to transmit the calories generated by the electronic chips to a heat sink placed under the metal soleplate of the module

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The latter is chosen as a good heat conductor, this solution is not optimized. Other solutions have been proposed in the art, in particular in patents DE 10 2009 044 240 A1 and US 2006/0175906 A1

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentEP2643921B1Architecture of interconnected electronic power modules for a rotating electric machine and a rotating electric machine including such an architecture
Publication Date: 2020.10.07 VALEO EQUIP ELECTRIC MOTEUR
  • EP2643921B1 patent drawingFigure 1~2
  • EP2643921B1 patent drawingFigure 3
  • EP2643921B1 patent drawingFigure 4~5

AI summary

The invention relates to an architecture of interconnected electronic power modules for a polyphase rotary machine. The invention comprises electrically interconnected power modules (5) and a connector (6) including one or more layers formed by pluralities of conductive traces borne by plates, such as to connect the power modules (51 to 53) to one another and to electrical elements of the rotary machine. The power modules (51 to 53) comprise a plurality of connection elements (510 to 530) brazed directly to components of the power modules (51 to 53) and, in the upper part, to conductive traces of the connector (6). This architecture includes a heat sink (4) equipped with open cavities (41 to 43) for receiving the power modules (51 to 53). The invention also relates to a polyphase rotary machine using such an architecture, in particular a dual three-phase alternator with synchronous rectification.