Power Overlay Leadframe Interconnection for Stress-Resistant Packaging
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Solution Overview
Problem
Standard power semiconductor device packages with solder ball grid arrays or land grid arrays are prone to early failure in high stress conditions such as temperature cycling, shock, and vibration, necessitating a more reliable interconnection method.
Innovation Solution
A power overlay (POL) packaging structure that replaces solder ball grid arrays or land grid arrays with a leadframe connection, which includes a dielectric layer, semiconductor devices, metal interconnects through vias, and a leadframe for reliable interconnection to an external circuit, providing structural rigidity through polymeric encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If solder ball grid arrays or land grid arrays are used to connect the POL package to an external circuit, then a low profile interconnection is achieved, but the interconnection is susceptible to early failure in high stress conditions
Solution Approach 1:
The patent introduces a leadframe as an intermediary component between the POL package and the external circuit. The leadframe provides a robust mechanical and electrical connection that replaces the fragile solder joints of BGAs/LGAs, thereby improving reliability while maintaining the low profile requirement through its integrated structure
2Ease of manufacture
If solder ball grid arrays or land grid arrays are used to connect the POL package to an external circuit, then an interconnection structure is provided, but the interconnection fails under temperature cycling, shock, and vibration
Solution Approach 1:
The leadframe is constructed as a composite structure combining different materials and structural elements to achieve both ease of manufacture and high reliability. The leadframe integrates multiple functions (electrical connection, mechanical support, thermal management) into a single robust component that resists temperature cycling, shock, and vibration
3Reliability
If a leadframe connection is used to replace solder ball grid arrays or land grid arrays, then interconnection reliability in high stress environments is enhanced, but the structural complexity increases
Solution Approach 1:
The leadframe connection merges multiple functions (electrical interconnection, mechanical support, and structural integrity) into a single integrated component. This consolidation reduces the overall package complexity compared to using separate BGA/LGA structures with additional underfill and encapsulation layers, while simultaneously enhancing reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The leadframe connection enhances interconnection reliability in high stress environments while minimizing costs, offering a robust solution for attaching semiconductor devices to external circuits.
Implementation Method 1
a metal interconnect structure electrically coupled to the plurality of connection pads of the at least one semiconductor device, with the metal interconnect structure extending through vias formed through the dielectric layer so as to be connected to the plurality of connection pads
Implementation Method 2
a leadframe electrically coupled to the POL sub-module, with the leadframe comprising leads configured to make an interconnection to an external circuit structure
Data Source
AI summary
A power overlay (POL) packaging structure that incorporates a leadframe connection is disclosed. The a POL structure includes a POL sub-module having a dielectric layer, at least one semiconductor device attached to the dielectric layer and that includes a substrate composed of a semiconductor material and a plurality of connection pads formed on the substrate, and a metal interconnect structure electrically coupled to the plurality of connection pads of the at least one semiconductor device, with the metal interconnect structure extending through vias formed through the dielectric layer so as to be connected to the plurality of connection pads. The POL structure also includes a leadframe electrically coupled to the POL sub-module, with the leadframe comprising leads configured to make an interconnection to an external circuit structure.