Modular Power Overlay Tiles for High-Density Power Distribution
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Solution Overview
Problem
Existing power systems, particularly in aircraft, face challenges in efficiently managing and distributing electrical power due to limitations in power switching components and distribution architectures.
Innovation Solution
A modular power overlay architecture is introduced, featuring sets of power overlay tiles with planar arrangements of power switching components on substrates, and a power overlay assembly base that can selectively receive and interchange these tiles to meet desired power module characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional power distribution architecture is used, then system simplicity is maintained, but power density and efficiency are limited
Solution Approach 1:
The power distribution system is divided into modular power overlay tiles that can be independently configured and assembled. Each tile contains specific power switching components arranged in a planar configuration, allowing the system to be segmented into functional units that can be selectively combined to achieve desired power density while maintaining manageable complexity through standardization.
Solution Approach 2:
The patent transitions from traditional three-dimensional power module stacking to a planar two-dimensional overlay architecture. Power switching components are arranged in substantially planar configurations on substrates, eliminating the need for vertical stacking and associated complex interconnect structures, thereby achieving higher power density with reduced architectural complexity.
2Loss of energy
If conventional power switching components are used, then design simplicity is maintained, but inductance and impedance losses are high
Solution Approach 1:
Power switching components within each overlay tile are arranged in specific local configurations optimized for electrical performance. The planar arrangement of switches, capacitors, and interconnects is designed to minimize current path lengths and reduce parasitic inductance and impedance in critical areas, achieving lower energy losses through localized optimization of component placement.
Solution Approach 2:
Multiple power switching components are merged into integrated planar assemblies on single substrates. The overlay tiles combine switches, capacitors, and interconnect structures into unified configurations that reduce the number of discrete components and interconnections, thereby minimizing total parasitic inductance and impedance while managing complexity through integration.
3Adaptability or versatility
If fixed power system configuration is used, then manufacturing simplicity is maintained, but adaptability to varying power demands is limited
Solution Approach 1:
The power system is segmented into standardized overlay tiles that can be independently manufactured and then assembled in different configurations. This segmentation allows each tile to be manufactured using consistent processes, while the modular nature enables flexible system configuration to meet varying power demands without requiring complex custom manufacturing for each application.
Solution Approach 2:
The overlay tiles are designed with universal interfaces and standardized configurations that allow the same basic tile designs to be used across multiple applications and power system configurations. This universality enables adaptability to varying power demands while simplifying manufacturing through standardization of components and assembly procedures.
Data Source
AI summary
A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.