Power Pack Surface as Conductive Shield

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Solution Overview

Problem

Electric shielding enclosures in electronic devices add weight and size, limiting design flexibility and increasing manufacturing complexity and cost, while failing to effectively protect against electrostatic discharge and electromagnetic interference.

Innovation Solution

Incorporating a conductive power pack surface as part of the electric shielding enclosure, which provides electrostatic and electromagnetic isolation by connecting the negative electrode of the power pack to the ground potential, thereby reusing the power pack surface to form a large conductive shield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional electric shielding enclosures are used to protect sensitive components, then protection against electrostatic discharge and electromagnetic interference is improved, but device weight and size increase

Engineering Contradiction:
Improveprotection against electrostatic discharge and electromagnetic interferenceVSAvoiddevice weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent combines the power pack surface with the electric shielding enclosure, making the power pack case itself serve as the shielding structure. This merging eliminates the need for separate shielding components, thereby reducing device weight and size while maintaining protection against electrostatic discharge and electromagnetic interference.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The power pack surface is given multiple functions: it serves both as the housing for the power pack and as the electric shielding enclosure. This multi-functionality reduces the overall number of components needed in the device, decreasing weight and complexity while providing necessary electromagnetic protection.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional electric shielding enclosures are used to protect sensitive components, then protection against electrostatic discharge and electromagnetic interference is improved, but device size increases

Engineering Contradiction:
Improveprotection against electrostatic discharge and electromagnetic interferenceVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The power pack housing is merged with the shielding enclosure structure, eliminating the need for additional space dedicated to separate shielding components. This integration reduces the overall device volume while maintaining effective electromagnetic protection.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The power pack case performs dual functions as both structural housing and electromagnetic shield, reducing the total volume required for the device by eliminating redundant components and optimizing space utilization.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If separate electric shielding enclosures are used, then protection effectiveness is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveprotection effectivenessVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By merging the power pack housing with the shielding enclosure, the patent reduces the number of separate components that need to be manufactured and assembled. This integration simplifies the manufacturing process, reduces assembly steps, and lowers production costs while maintaining protection effectiveness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The multi-functional power pack case reduces manufacturing complexity by eliminating the need to produce and assemble separate shielding components. The single component serves multiple purposes, streamlining the manufacturing process and reducing overall device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the weight and size of electronic devices, enhances design flexibility, and effectively protects sensitive components from electrostatic discharge and electromagnetic interference, while also reducing Specific Absorption Rate (SAR) and improving hearing-aid compatibility.

Implementation Method 1

Some circuits or components are sensitive to static electric discharge or to exposure to electromagnetic energy that can adversely affect their operation.

Methodology Applied
Scientific EffectElectrostatic discharge: Electrostatic Discharge

Implementation Method 2

Some devices include circuits or components that emit electro-magnetic energy that is able to disturb other components of the device and are enclosed in an electric shielding enclosure to prevent emission of such energy outside of the enclosure.

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentEP2785167B1Electric shielding enclosure including power pack
Publication Date: 2018.07.11 BLACKBERRY LTD
  • EP2785167B1 patent drawingFigure 1
  • EP2785167B1 patent drawingFigure 2
  • EP2785167B1 patent drawingFigure 3

AI summary

An electric shielding enclosure (218) that encloses a volume (242). The electric shielding enclosure includes a conductive structure that partially encloses the volume (210, 212, 214) and that has an edge (240, 436) defining an opening into the volume. A conductive power pack surface (216) is configured to fill at least a part of the opening and has a number of conductive connections (260, 262). The conductive connections include a first conductive connection (260) located in proximity to a first point of the edge, and a second conductive connection (262) located in proximity to a second point of the edge, where the second point being across the opening from the first point. Each of the conductive connections within the conductive connections is electrically coupled to the conductive structure.