Embedded Power Package Sidewall Contacts Using Tie Bars
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor power device packages face challenges in improving performance, cost, and manufacturability, particularly in embedded packages that require efficient electrical interconnects and cost-effective manufacturing processes.
Innovation Solution
A method and structure for a semiconductor package that includes a metal frame surrounding a central opening with tie bars connected to a stabilizing section, where the tie bars are retained as exposed outer contacts, and a dielectric material encapsulates the semiconductor die, allowing for electrical connections through recesses and metallization layers, and forming LTI features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If tie bars are removed or insulated from the exterior environment in traditional embedded packages, then manufacturing complexity is reduced, but additional processing steps and costs are incurred
Solution Approach 1:
The tie bars serve dual functions: they provide mechanical support during assembly and become the final exposed outer contacts of the package. This self-service approach eliminates the need for separate contact formation steps, reducing both cost and processing complexity while maintaining manufacturing ease
Solution Approach 2:
The tie bars perform multiple functions throughout the manufacturing process and in the final product: structural support, electrical connection, and serving as the external contact points. This multi-functionality consolidates several components into one, reducing overall manufacturing complexity and cost
2Productivity
If traditional embedded package structures are used with separate contact formation, then manufacturing processes are well-established, but processing costs and time increase
Solution Approach 1:
The patent merges the tie bar structure with the final contact structure, combining what were previously separate manufacturing operations into a single integrated process. This eliminates redundant steps and reduces processing time while maintaining established manufacturing techniques
Solution Approach 2:
The tie bars are positioned and configured during the initial lead frame assembly to serve as future contacts. This preliminary action eliminates the need for subsequent contact formation steps, reducing processing time and improving overall productivity
Data Source
AI summary
A method of forming a semiconductor package includes providing a lead frame including a metal frame at least partially surrounding a central opening and a plurality of tie bars connected between the metal frame and an adjacent stabilizing metal section, arranging the lead frame on a temporary carrier, arranging a semiconductor die on the temporary carrier within the central opening, forming a dielectric material that fills the central opening and encapsulates the semiconductor die, forming a first recess in the dielectric material above the semiconductor die so as to expose a first surface of the semiconductor die, electrically connecting terminals of the semiconductor die with the metal frame, and forming exposed outer contacts of the semiconductor package from the tie bars.