Power Module Package Structure for Terminal Leakage Isolation
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Solution Overview
Problem
Power modules operating at high voltage or high current face challenges in preventing current leakage between adjacent terminals, which compromises product reliability.
Innovation Solution
The power module package design includes a substrate with first and second terminal assemblies, where the substrate protrudes from the contact section to create a height difference, increasing the creepage distance between power device terminals and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power module operates at high voltage or high current, then the power conversion capability is improved, but current leakage between adjacent terminals occurs which decreases product reliability
Solution Approach 1:
The substrate is designed to protrude from the first contact section and extend to a position under the first non-contact section, creating a height difference between terminals. This three-dimensional arrangement increases the creepage distance between adjacent terminals, effectively preventing current leakage while maintaining high power operation capability.
Solution Approach 2:
The substrate structure is specifically designed with different heights at different locations. The first contact section and first non-contact section are positioned at different vertical levels, creating localized electrical isolation zones that prevent current leakage between adjacent terminals while allowing high voltage operation.
2Reliability
If the creepage distance between adjacent terminals is increased to prevent current leakage, then product reliability is improved, but the volume of the power module increases
Solution Approach 1:
Instead of increasing the horizontal distance between terminals, the invention utilizes the vertical dimension by making the substrate protrude and creating height differences. This allows the creepage distance to be increased in the vertical direction while maintaining a compact horizontal footprint, thus preventing current leakage without significantly increasing overall module volume.
Solution Approach 2:
The substrate structure is nested within the terminal assembly, with the substrate extending under the non-contact section. This nested arrangement allows the creepage path to be formed within the existing terminal structure, increasing electrical isolation distance without adding external volume to the power module.
Data Source
AI summary
A power module package is provided. The power module package includes an electronic assembly, a first terminal assembly and a second terminal assembly. The electronic assembly at least includes a substrate. The first terminal assembly includes a first power device terminal, and the second terminal assembly includes a second power device terminal. The first power device terminal and the second power device terminal respectively extend from different surfaces of the substrate to form a height difference therebetween. The first power device terminal includes a first contact section and a first non-contact section. The first contact section is directly connected to the substrate, and the first non-contact section is not in contact with the substrate. The substrate protrudes from the first contact section and extends to a position under the first non-contact section.