Power Electronic Packaging for Transient Thermal Peak Management
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Solution Overview
Problem
Current thermal management solutions for power electronics primarily focus on steady-state operations, neglecting transient processes with time-varying loads, which can lead to reduced performance, reliability, and increased device weight and footprint.
Innovation Solution
A power electronic package design incorporating encapsulated heat sinks with a melting point between 80°C and 120°C, thermally conductive heat spreading elements like nano-sized graphene particles, and heat pipes with a working fluid boiling point in the same range, dispersed within an encapsulant to effectively manage heat dissipation during transient processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional steady-state cooling solutions are used, then thermal management is adequate for constant loads, but performance and reliability deteriorate during transient processes with time-varying loads
Solution Approach 1:
The patent changes the thermal management approach from steady-state constant thermal conductivity to transient-variable thermal conductivity by incorporating phase change materials that alter their thermal properties in response to temperature changes during transient loading conditions
Solution Approach 2:
The patent utilizes phase transitions of encapsulated heat sink materials (melting point 80-120°C) and heat pipe working fluids (boiling point 80-120°C) to absorb and dissipate heat dynamically during transient processes, enabling the system to adapt to time-varying loads
2Temperature
If larger heat sinks are used to manage transient heat loads, then thermal management improves, but device weight and footprint increase
Solution Approach 1:
The patent employs phase change materials with melting points of 80-120°C that absorb large amounts of heat during transient peaks through melting, and heat pipes with working fluids having boiling points of 80-120°C that rapidly transport heat away from the die, enabling compact heat sink design without sacrificing transient thermal management capability
Solution Approach 2:
The patent creates a composite thermal management system combining encapsulated phase change heat sink materials, thermally conductive heat spreading elements, and heat pipes within an encapsulant, achieving superior transient thermal performance in a compact configuration
3Temperature
If larger heat sinks are used to manage transient heat loads, then thermal management improves, but device footprint increases
Solution Approach 1:
The patent utilizes phase transitions of encapsulated heat sink materials (melting point 80-120°C) and heat pipe working fluids (boiling point 80-120°C) to absorb and dissipate heat dynamically during transient processes, enabling compact heat sink design without sacrificing transient thermal management capability
Solution Approach 2:
The patent embeds multiple thermal management components (encapsulated heat sinks, heat pipes, thermally conductive elements) within the encapsulant surrounding the semiconductor die, creating a nested compact structure that maximizes thermal management effectiveness within minimal footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal management by absorbing and dissipating heat efficiently during peak loads, reducing the size and weight of heat sinks, and providing significant overheat protection, thereby improving performance and reliability while minimizing device footprint.
Implementation Method 1
an increased temperature of the PE package semiconductor die(s) may cause the heat sink material of the encapsulated heat sinks to melt, thereby absorbing heat from the semiconductor die(s)
Implementation Method 2
a plurality of heat pipes may be located in the encapsulant... the at least one heat pipe is configured to direct heat away from the active surface of the semiconductor die
Implementation Method 3
each encapsulated heat sink of the plurality of encapsulated heat sinks may further include a plurality of thermally conductive heat spreading elements located within the encapsulation layer
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
A power electronic package may comprise a substrate (110), a semiconductor die (102) bonded to a first surface of the substrate (110), and an encapsulant (130) deposited over the semiconductor die (102) and substrate (110). A plurality of encapsulated heat sinks (132) may be dispersed in the encapsulant (130) and/or a plurality of heating pipes may be located in the encapsulant (130) and over an active surface (106) of the semiconductor die (102).