Semiconductor Power Pad Contact Detection Circuit
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Solution Overview
Problem
Semiconductor devices face defects due to warpage, leading to poor contact between power pads and the semiconductor substrate, which hinders stable operation and detection of defective contacts.
Innovation Solution
A semiconductor device design incorporating a first pad, a second pad, a connection circuit, and a detection circuit that utilizes a test mode signal and second voltage to differentiate between normal and abnormal contact conditions, allowing for the generation of a defect detection signal and enabling the identification of poor contact issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If warpage control is not improved, then manufacturing cost is reduced, but poor contact of power pad occurs
Solution Approach 1:
The patent applies preliminary action by performing contact detection before the semiconductor device is fully packaged and shipped. The detection circuit is built into the device structure itself, allowing contact quality to be verified in advance during or after bonding but before final product completion. This enables defective devices to be identified and removed early, preventing field failures without requiring complex external testing equipment.
Solution Approach 2:
The patent implements self-service by incorporating the detection circuit within the semiconductor device structure itself. The device uses its own internal resources (power pads, connection circuits, detection circuitry) to perform self-diagnosis of contact quality. This eliminates the need for complex external testing equipment and simplifies the overall system while maintaining high detection capability.
2Difficulty of detecting and measuring
If detection circuit is added, then poor contact detection capability is improved, but device complexity increases
Solution Approach 1:
The patent applies universality by designing the detection circuit to serve multiple functions: it can detect contact quality, provide diagnostic information for manufacturing process improvement, and potentially guide repair decisions. The same detection infrastructure is used regardless of whether the device is functioning normally or exhibiting symptoms, making the detection capability universally applicable throughout the product lifecycle.
Solution Approach 2:
The patent merges the detection function with the existing power pad and connection circuit structures. Rather than adding completely separate detection equipment, the detection circuit is integrated into the existing power delivery path, combining the power supply function with the diagnostic function in a unified circuit architecture that reduces overall complexity.
3Reliability
If warpage is not controlled, then manufacturing process is simpler, but power supply stability deteriorates
Solution Approach 1:
The patent implements feedback by using the detection circuit to provide information about contact quality back to the manufacturing process. The detection results can be used to adjust bonding parameters, rework defective units, or identify process drift that needs correction. This closed-loop feedback enables continuous improvement of contact precision without requiring overly stringent upfront process controls.
Data Source
AI summary
A semiconductor device may include a first pad configured to provide a first voltage. The semiconductor device may include a second pad. The semiconductor device may include a connection circuit configured to couple the first pad to the second pad on the basis of a connection signal or electrically separate the second pad from the first pad on the basis of the connection signal. The semiconductor device may include a detection circuit configured to generate a defect detection signal on the basis of a test mode signal and a second voltage received from the second pad.