Power PCB Sidewall Cooling Layout for Compact Insulated Assembly
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Solution Overview
Problem
Existing electrical devices face challenges in achieving structural compactness, ease of assembly, and effective heat dissipation without causing coolant pressure drops, due to the use of plastic members and complex screw fixation, which also complicates the design of coolant channels.
Innovation Solution
An electrical device design featuring a heat-dissipating member with a cooling circuit adjacent to a side wall, an insulating and heat-dissipating element between the side wall and the power circuit board, and heat-generating elements on the circuit board, allowing direct heat conduction to the cooling circuit while ensuring electrical insulation, thus omitting plastic members and simplifying assembly and coolant channel design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is mounted in a horizontal orientation above the heat sink with a plastic member for support and insulation, then electrical insulation is ensured, but space is wasted and structural compactness is difficult to achieve
Solution Approach 1:
The patent merges the insulation function and heat dissipation function into a single integrated component (insulating and heat-dissipating element). This element is disposed between the side wall of the heat sink and the circuit board, providing both electrical insulation and thermal conduction path to the cooling circuit, thereby eliminating the need for separate plastic support members and achieving compact structure.
Solution Approach 2:
The insulating and heat-dissipating element acts as an intermediary component between the circuit board and the heat sink. It provides the necessary electrical insulation while simultaneously serving as a thermal conduction path, allowing heat to be efficiently transferred from the circuit board to the cooling circuit without requiring additional space-consuming components.
2Strength
If multiple screws are used to fix the circuit board in place, then the circuit board is securely mounted, but assembly becomes more complicated and stress on the circuit board increases
Solution Approach 1:
The patent extracts and eliminates the need for multiple screws and plastic support members by using the insulating and heat-dissipating element as an integrated mounting solution. The circuit board is directly mounted on the heat sink through this element, which provides both insulation and structural support, thereby simplifying assembly and reducing the number of components.
3Temperature
If turbulators are provided in the coolant channels to increase heat dissipation efficiency, then heat dissipation is improved, but pressure drop in the coolant increases
Solution Approach 1:
The patent changes the heat dissipation approach from internal coolant channel turbulence (2D/3D complexity) to external thermal conduction through the insulating and heat-dissipating element. By positioning the cooling circuit adjacent to the element and using it as a thermal bridge, the system achieves efficient heat transfer without requiring complex internal turbulator structures that would cause pressure drops.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves structural compactness, simplifies assembly, enhances heat dissipation efficiency, and prevents coolant pressure drops by eliminating the need for turbulators, thereby improving cost-effectiveness and performance.
Implementation Method 1
the insulating and heat-dissipating element is disposed between the adjacent part of the side wall and the first surface of the power circuit board; wherein the heat-generating element is disposed on the first surface of the power circuit board
Data Source
AI summary
An electrical device which includes a heat-dissipating member providing a main body with a top surface and a side wall extending in an extension direction transverse to the top surface. The heat-dissipating member further includes a cooling circuit for circulating a cooling medium, and is disposed in the main body and adjacent to the adjacent part of the side wall. The electrical device further includes a power circuit board assembly with a power circuit board and a heat-generating element disposed on the power circuit board. The electrical device further includes an insulating and heat-dissipating element, disposed between the adjacent part of the side wall and the first surface of the power circuit board, wherein the heat-generating element is disposed on the first surface.