Multi-Layer Power Rail Layout for IC Design Rule Compliance
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Solution Overview
Problem
The miniaturization of integrated circuits poses challenges in design and manufacturing due to stricter specifications and reliability issues, particularly in ensuring uniformity and efficiency of metal rail layouts while adhering to design rules, which existing EDA tools struggle to address effectively.
Innovation Solution
The proposed solution involves a multi-layer metal rail structure where the first layer has uniform pitch and width, the second layer has varying pitches and widths, and a third layer with uniformly spaced metal rails, allowing for compact integration while maintaining signal quality and reducing resistance, and an automated method to detect and replace layout patterns violating design rules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-layer metal rail structure with varying pitches and widths is implemented, then signal quality and resistance are improved, but device complexity increases
Solution Approach 1:
The patent divides the metal rail system into multiple layers (first layer with uniform pitch, second layer with varying pitch, third layer with uniform pitch) where each layer serves specific routing functions. This segmentation allows optimization of signal quality in critical areas while maintaining manufacturing simplicity in other areas, resolving the contradiction between reliability and complexity.
Solution Approach 2:
The second layer metal rails have varying pitches and widths tailored to specific local requirements for signal routing and impedance control, while the first and third layers maintain uniform pitches for manufacturing efficiency. This local quality approach improves signal quality where needed without unnecessarily increasing overall device complexity.
2Manufacturing precision
If automated detection and replacement of layout patterns is implemented, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The EDA tool automatically detects layout patterns that violate design rules and performs replacement without manual intervention. This self-service capability improves manufacturing precision by ensuring design rule compliance while the automation reduces the operational complexity burden on designers, effectively resolving the contradiction between precision and complexity.
3Productivity
If miniaturization is pursued, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent transitions from two-dimensional planar layout to three-dimensional multi-layer metal rail structure. This dimensional change allows continued miniaturization in the planar area while maintaining manufacturing precision through the added vertical dimension, where each layer can be optimized independently for both size and precision requirements.
Data Source
AI summary
Disclosed herein are related to an integrated circuit having a dual power structure with an efficient layout and a method of forming the integrated circuit. In one aspect, the integrated circuit includes a substrate, a first layer facing the substrate, and a second layer facing the first layer. In one aspect, the first layer includes a set of first metal rails, where each of the set of first metal rails may be separated from its adjacent one of the set of first metal rails according to a uniform pitch along a direction. In one aspect, the second layer includes a set of second metal rails, where the set of second metal rails may include two adjacent second metal rails separated according to a first pitch along the direction and additional two adjacent second metal rails separated according to a second pitch along the direction.