Power Semiconductor Device Back-Side IC Mounting
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Solution Overview
Problem
The integration of switching elements and integrated circuits in power semiconductor devices faces challenges in achieving high performance and integration while maintaining effective heat radiation characteristics, particularly in large-capacity applications where space and heat management are critical.
Innovation Solution
A power semiconductor device design featuring a conductive board with a switching element mounted on it, along with an integrated circuit positioned at a distance from the switching element, allowing for improved integration and heat management through the conductive board's heat radiation capabilities without compromising the heat radiation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the integrated circuit is mounted close to the switching element for integration, then the degree of integration is improved, but the heat radiation characteristic deteriorates
Solution Approach 1:
The patent transitions from planar integration (mounting IC on the same surface as switching element) to three-dimensional integration by mounting the integrated circuit on the back surface of the switching element. This spatial reconfiguration maintains integration benefits while separating heat generation zones, allowing independent heat management pathways.
Solution Approach 2:
The patent divides the semiconductor device into functionally independent modules: the switching element module and the integrated circuit module, mounted on opposite surfaces. This segmentation allows each module to be optimized independently for its specific function while maintaining system-level integration, with the switching element focused on power handling and the IC on control functions.
2Loss of energy
If the size of the switching element is increased to reduce power loss, then the performance is improved, but the space for mounting integrated circuit decreases
Solution Approach 1:
By utilizing the back surface of the switching element for mounting the integrated circuit, the patent effectively adds a second mounting plane. This allows the front surface to be fully dedicated to minimizing power loss through optimized switching element geometry, while the back surface provides adequate space for IC mounting without compromising either objective.
3Ease of manufacture
If the integrated circuit is formed on the same substrate as the switching element for process commonality, then the ease of manufacture is improved, but the performance of switching element deteriorates
Solution Approach 1:
The patent separates the switching element and integrated circuit onto different substrates mounted on opposite surfaces. This allows each substrate to be manufactured and optimized independently using the most appropriate processes for its specific function, avoiding the performance compromises that would result from forcing process commonality on dissimilar device types.
Solution Approach 2:
The patent introduces a conductor plate as an intermediary component that provides both electrical connection and thermal management functions. This mediator enables independent optimization of the switching element and integrated circuit while maintaining their functional integration through the conductor plate interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the performance and integration of the integrated circuit while maintaining effective heat radiation, preventing overheating and ensuring the reliability of the power semiconductor device, especially in high-capacity applications.
Implementation Method 1
the conductive board's heat radiation capabilities without compromising the heat radiation characteristics
Data Source
AI summary
A power semiconductor device includes a conductive board and a switching element mounted on the conductive board and electrically connected thereto. The power semiconductor device also includes an integrated circuit mounted on the conductive board at a distance from the switching element and electrically connected thereto. The switching element turns ON/OFF a connection between first and second main electrodes in response to a control signal inputted to a control electrode. The integrated circuit includes a control circuit which controls ON/OFF the switching element and a back side voltage detection element which detects a voltage of the back side of the integrated circuit.